ZHCSSL3R April   2000  – February 2025 LP2980-N

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Output Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors (Legacy Chip)
          2. 7.1.1.1.2 Aluminum Electrolytic Capacitors (Legacy Chip)
          3. 7.1.1.1.3 Multilayer Ceramic Capacitors (Legacy Chip)
        2. 7.1.1.2 Recommended Output Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
      2. 8.1.2 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision Q (November 2023) to Revision R (February 2025)

  • Changed description of N/C pin in Pin Functions table and added footnote 1Go
  • Added ESR range for output capacitorGo
  • Changed Short-Circuit Current vs Time (New Chip), Short-Circuit Current vs Temperature (New Chip), Short-Circuit Current vs Time (New Chip) curvesGo
  • Added 1μF ESR Range vs IOUT (Legacy Chip), 2.2μF ESR Range vs IOUT (Legacy Chip), and 10μF ESR Range vs IOUT (Legacy Chip) curvesGo
  • Added Recommended Output Capacitors (Legacy Chip) sectionGo
  • Added Tantalum Capacitors (Legacy Chip) sectionGo
  • Added Aluminum Electrolytic Capacitors (Legacy Chip) sectionGo
  • Added Multilayer Ceramic Capacitors (Legacy Chip) sectionGo
  • Changed Recommended Output Capacitors (New Chip) sectionGo
  • Changed title and last paragraph of Input Capacitor Requirements sectionGo

Changes from Revision P (August 2016) to Revision Q (November 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更改了整个文档以与当前系列格式保持一致Go
  • 向文档添加了 M3 器件Go
  • Updated Absolute Maximum Ratings, Recommended Operating Conditions, Electrical Characteristics and Thermal Information for M3-suffix(new chip)Go
  • Added Device Nomenclature sectionGo