ZHCSSL3R April   2000  – February 2025 LP2980-N

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Output Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors (Legacy Chip)
          2. 7.1.1.1.2 Aluminum Electrolytic Capacitors (Legacy Chip)
          3. 7.1.1.1.3 Multilayer Ceramic Capacitors (Legacy Chip)
        2. 7.1.1.2 Recommended Output Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
      2. 8.1.2 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

5.6 Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0V or 2.5V (whichever is greater), IOUT = 1mA, ON/OFF pin tied to VIN, CIN = 1.0µF, COUT = 2.2µF for the legacy chip, and COUT = 4.7µF for the new chip (unless otherwise noted)

LP2980-N Output Voltage vs Temperature (Legacy Chip)
 
Figure 5-1 Output Voltage vs Temperature (Legacy Chip)
LP2980-N Output Voltage vs VIN (Legacy Chip)
 
Figure 5-3 Output Voltage vs VIN (Legacy Chip)
LP2980-N Dropout Voltage vs VIN (New Chip)
 
Figure 5-5 Dropout Voltage vs VIN (New Chip)
LP2980-N Dropout Voltage vs Temperature (Legacy Chip)
 
Figure 5-7 Dropout Voltage vs Temperature (Legacy Chip)
LP2980-N Dropout Voltage vs Load Current (Legacy Chip)
 
Figure 5-9 Dropout Voltage vs Load Current (Legacy Chip)
LP2980-N Ground Pin Current vs Temperature (Legacy Chip)
 
Figure 5-11 Ground Pin Current vs Temperature (Legacy Chip)
LP2980-N Ground Pin Current vs Load Current (Legacy Chip)
 
Figure 5-13 Ground Pin Current vs Load Current (Legacy Chip)
LP2980-N Input Current vs VIN (Legacy Chip)
 
Figure 5-15 Input Current vs VIN (Legacy Chip)
LP2980-N Short-Circuit Current vs Time (Legacy Chip)
 
Figure 5-17 Short-Circuit Current vs Time (Legacy Chip)
LP2980-N Short-Circuit Current vs Temperature (Legacy Chip)
 
Figure 5-19 Short-Circuit Current vs Temperature
(Legacy Chip)
LP2980-N Short-Circuit Current vs Time (Legacy Chip)
 
Figure 5-21 Short-Circuit Current vs Time (Legacy Chip)
LP2980-N Output Impedance vs Frequency (Legacy Chip)
 
Figure 5-23 Output Impedance vs Frequency (Legacy Chip)
LP2980-N Output Noise Density (Legacy Chip)
 
Figure 5-25 Output Noise Density (Legacy Chip)
LP2980-N Output Noise Density vs IOUT (New Chip)
VOUT = 3.3V, COUT = 2.2μF
Figure 5-27 Output Noise Density vs IOUT (New Chip)
LP2980-N Ripple Rejection vs COUT (New Chip)
VOUT = 3.3V, IOUT = 50mA
Figure 5-29 Ripple Rejection vs COUT (New Chip)
LP2980-N Input to Output Leakage vs Temperature (Legacy Chip)
 
Figure 5-31 Input to Output Leakage vs Temperature
(Legacy Chip)
LP2980-N Output Reverse Leakage vs Temperature (New Chip)
 
Figure 5-33 Output Reverse Leakage vs Temperature
(New Chip)
LP2980-N Turn-On Waveform (New Chip)
VOUT = 3.3V, IOUT = 50mA
Figure 5-35 Turn-On Waveform (New Chip)
LP2980-N Turnoff Waveform (New Chip)
VOUT = 3.3V, IOUT = 50mA
Figure 5-37 Turnoff Waveform (New Chip)
LP2980-N ON/OFF Pin Current vs VON/OFF (New Chip)
VIN = 16V
Figure 5-39 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2980-N 1μF ESR Range vs IOUT (Legacy Chip)
 
Figure 5-41 1μF ESR Range vs IOUT (Legacy Chip)
LP2980-N 10μF ESR Range vs IOUT (Legacy Chip)
 
Figure 5-43 10μF ESR Range vs IOUT (Legacy Chip)
LP2980-N Output Voltage vs Temperature (New Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-2 Output Voltage vs Temperature (New Chip)
LP2980-N Output Voltage vs VIN (New Chip)
 
Figure 5-4 Output Voltage vs VIN (New Chip)
LP2980-N Dropout Voltage vs VIN and Temperature (New Chip)
 
Figure 5-6 Dropout Voltage vs VIN and Temperature (New Chip)
LP2980-N Dropout Voltage vs Temperature (New Chip)
 
Figure 5-8 Dropout Voltage vs Temperature (New Chip)
LP2980-N Dropout Voltage vs Load Current (New Chip)
 
Figure 5-10 Dropout Voltage vs Load Current (New Chip)
LP2980-N Ground Pin Current vs Temperature (New Chip)
 
Figure 5-12 Ground Pin Current vs Temperature (New Chip)
LP2980-N Ground Pin Current vs Load Current (New Chip)
 
Figure 5-14 Ground Pin Current vs Load Current (New Chip)
LP2980-N Input Current vs Input Voltage (New Chip)
 
Figure 5-16 Input Current vs Input Voltage (New Chip)
LP2980-N Short-Circuit Current vs Time (New Chip)
VIN = 6V
Figure 5-18 Short-Circuit Current vs Time (New Chip)
LP2980-N Short-Circuit Current vs Temperature (New Chip)
 
Figure 5-20 Short-Circuit Current vs Temperature
(New Chip)
LP2980-N Short-Circuit Current vs Time (New Chip)
 VIN = 16V
Figure 5-22 Short-Circuit Current vs Time (New Chip)
LP2980-N Output Impedance vs Frequency (Legacy Chip)
 
Figure 5-24 Output Impedance vs Frequency (Legacy Chip)
LP2980-N Output Noise Density vs COUT (New Chip)
VOUT = 3.3V, IOUT = 50mA
Figure 5-26 Output Noise Density vs COUT (New Chip)
LP2980-N Ripple Rejection (Legacy Chip)
 
Figure 5-28 Ripple Rejection (Legacy Chip)
LP2980-N Ripple Rejection vs IOUT (New Chip)
VOUT = 3.3V, COUT = 2.2μF
Figure 5-30 Ripple Rejection vs IOUT (New Chip)
LP2980-N Output Reverse Leakage vs Temperature (Legacy Chip)
 
Figure 5-32 Output Reverse Leakage vs Temperature
(Legacy Chip)
LP2980-N Turn-On Waveform (Legacy Chip)
 
Figure 5-34 Turn-On Waveform
(Legacy Chip)
LP2980-N Turnoff Waveform (Legacy Chip)
 
Figure 5-36 Turnoff Waveform (Legacy Chip)
LP2980-N ON/OFF Pin Current vs VON/OFF (Legacy Chip)
 
Figure 5-38 ON/OFF Pin Current vs VON/OFF (Legacy Chip)
LP2980-N ON/OFF Pin Current vs VON/OFF (New Chip)
VIN = 4.3V
Figure 5-40 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2980-N 2.2μF ESR Range vs IOUT (Legacy Chip)
 
Figure 5-42 2.2μF ESR Range vs IOUT (Legacy Chip)