ZHCSSL3R April   2000  – February 2025 LP2980-N

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Output Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors (Legacy Chip)
          2. 7.1.1.1.2 Aluminum Electrolytic Capacitors (Legacy Chip)
          3. 7.1.1.1.3 Multilayer Ceramic Capacitors (Legacy Chip)
        2. 7.1.1.2 Recommended Output Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
      2. 8.1.2 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.1.2 Device Nomenclature

Table 8-1 Available Options
PRODUCT(1) VOUT
LP2980vwxxy-z.z/NOPB v is the accuracy specification for the legacy chip (A or blank). See the Electrical Characteristics for more information. This character is insignificant for the new chip.
w is the operating temperature range (I = −40°C to 125°C).
xx is the package designator (M5 = SOT-23).
y is the reel designator size. See the Package Addendum for more information on package quantity.
z.z is the nominal output voltage (for example, 3.3 = 3.3V; 5.0 = 5.0V).
/NOPB indicates material construction that does not use Lead (Pb).

This device ships with the legacy chip (CSO: DLN or GF8) or the new chip (CSO: RFB) which uses the latest manufacturing flow. The reel packaging label provides CSO information to distinguish which chip is used. Device performance for new and legacy chips is denoted throughout the data sheet.

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.