ZHCSHM1C September   2017  – March 2018 LMZM33603

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     简化电路原理图
  3. 3 说明
    1.     安全操作区域
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 5 V)
    8. 6.8 Typical Characteristics (VIN = 12 V)
    9. 6.9 Typical Characteristics (VIN = 24 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Feed-Forward Capacitor, CFF
      3. 7.3.3  Output Current vs Output Voltage
      4. 7.3.4  Voltage Dropout
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Synchronization (SYNC)
      7. 7.3.7  Input Capacitors
      8. 7.3.8  Output Capacitors
      9. 7.3.9  Output On/Off Enable (EN)
      10. 7.3.10 Programmable Undervoltage Lockout (UVLO)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Overcurrent Protection (OCP)
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Feed-Forward Capacitor (CFF)
        4. 8.2.2.4 Setting the Switching Frequency
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitor Selection
        7. 8.2.2.7 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Theta JA vs PCB Area
    4. 10.4 EMI
      1. 10.4.1 EMI Plots
    5. 10.5 Package Specifications
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 使用 WEBENCH® 工具创建定制设计
    2. 11.2 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings

Over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN –0.3 42 V
EN/SYNC –5.5 VIN + 0.3 V
PGOOD –0.3 15 V
FB, RT –0.3 4.5 V
Output voltage SW –1 VIN + 0.3 V
SW (< 10-ns transients) –5 42 V
VOUT –0.3 VIN V
Sink current PGOOD 3 mA
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20 to 2000 Hz 20 G
Operating IC junction temperature, TJ(2) –40 125 °C
Operating ambient temperature, TA(2) –40 105 °C
Storage temperature, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.