ZHCSM75U August   1999  – October 2020 LMV331 , LMV339 , LMV393

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, VCC+ = 2.7 V
    6. 6.6 Electrical Characteristics, VCC+ = 5 V
    7. 6.7 Switching Characteristics, VCC+ = 2.7 V
    8. 6.8 Switching Characteristics, VCC+ = 5 V
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 Minimum Overdrive Voltage
        3. 8.2.2.3 Output and Drive Current
        4. 8.2.2.4 Response Time
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RUC|14
  • D|14
  • PW|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1)LMV339LMV393LMV331UNIT
DPWRUCDDDUDGKPWDBVDCK
14 PINS8 PINS5 PINS
RθJAJunction-to-ambient thermal resistance8611321697210172149206252°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.3
RθJBJunction-to-board thermal resistance59.0
ψJTJunction-to-top characterization parameter1.2
ψJBJunction-to-board characterization parameter59.0
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.