ZHCSNW8A October   2022  – December 2022 LMG2610

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 GaN Power FET Switching Parameters
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  GaN Power FET Switching Capability
      2. 8.3.2  Turn-On Slew-Rate Control
      3. 8.3.3  Current-Sense Emulation
      4. 8.3.4  Bootstrap Diode Function
      5. 8.3.5  Input Control Pins (EN, INL, INH)
      6. 8.3.6  INL - INH Interlock
      7. 8.3.7  AUX Supply Pin
        1. 8.3.7.1 AUX Power-On Reset
        2. 8.3.7.2 AUX Under-Voltage Lockout (UVLO)
      8. 8.3.8  BST Supply Pin
        1. 8.3.8.1 BST Power-On Reset
        2. 8.3.8.2 BST Under-Voltage Lockout (UVLO)
      9. 8.3.9  Over-Current Protection
      10. 8.3.10 Over-Temperature Protection
      11. 8.3.11 Fault Reporting
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Turn-On Slew-Rate Design
        2. 9.2.2.2 Current-Sense Design
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Solder-Joint Stress Relief
        2. 9.4.1.2 Signal-Ground Connection
        3. 9.4.1.3 CS Pin Signal
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • RRG|40
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings

Unless otherwise noted: voltages are respect to AGND(1)
MIN MAX UNIT
VDS(ls) Low-side drain-source (SW to SL) voltage, FET off 650 V
VDS(surge)(ls) Low-side drain-source (SW to SL) voltage, surge condition, FET off (2) 720 V
VDS(tr)(surge)(ls) Low-side drain-source (SW to SL) transient ringing peak voltage, surge condition, FET off (2) 800 V
VDS(hs) High-side drain source (DH to SW) voltage, FET off 650 V
VDS(surge)(hs) High-side drain-source (DH to SW) voltage, surge condition, FET off (2) 720 V
VDS(tr)(surge)(hs) High-side drain-source (DH to SW) transient ringing peak voltage, surge condition, FET off (2) 800 V
Pin voltage AUX –0.3 30 V
EN, INL, INH, FLT –0.3 VAUX + 0.3 V
CS –0.3 5.5 V
RDRVL –0.3 4 V
Pin voltage to SW BST –0.3 30 V
RDRVH –0.3 4 V
ID(peak)(ls) Low-side drain (SW to SL) peak current, FET on   –6.4 Internally limited A
IS(peak)(ls) Low-side source (SL to SW) peak current, FET off 6.4 A
ID(peak)(hs) High-side drain (DH to SW) peak current, FET on    –4 Internally limited A
IS(peak)(hs) High-side source (SW to DH) peak current, FET off 4 A
Positive sink current CS 10 mA
FLT (while asserted) Internally limited mA
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) See GaN Power FET Switching Capability for more information on the GaN FET switching capability.