SLUSFF6 April   2025 LMG1020-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Output Stage
      3. 6.3.3 VDD and Undervoltage Lockout
      4. 6.3.4 Overtemperature Protection (OTP)
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Handling Ground Bounce
        2. 7.2.2.2 Creating Nanosecond Pulse With LMG1020-Q1
      3. 7.2.3 VDD and Overshoot
      4. 7.2.4 Operating at Higher Frequency
      5. 7.2.5 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Gate Drive Loop Inductance and Ground Connection
        2. 7.4.1.2 Bypass Capacitor
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Example

Figure 7-10 presents a typical layout of LMG1020-Q1 with a 0402 decoupling capacitor C1, which is placed as close as possible to LMG1020-Q1. The ground return at GaN FET Kelvin source immediately flows through a via to the closest inner layer, and overlaps with the top layer traces.

Figure 7-11 presents a layout of LMG1020-Q1 with a 0.1µF feed-through capacitor (C1) and a larger 1μF capacitor (C3) for decoupling. In this design, the feed-through capacitor C1 is placed in a shunt-through manner for lower noise decoupling, and C3 is placed next to C1. 0201 resistors are used at the output of LMG1020-Q1, which brings lower parasitic inductance than 0402 package.

LMG1020-Q1 Typical LMG1020-Q1 Layout
                                                  With Ball-Grid GaN FET And 0402 Decoupling
                                                  CapacitorFigure 7-10 Typical LMG1020-Q1 Layout With Ball-Grid GaN FET And 0402 Decoupling Capacitor
LMG1020-Q1 Typical Layout Of LMG1020-Q1 And A
                                                  Feed-Through Decoupling Capacitor With A Capacitor
                                                  LoadFigure 7-11 Typical Layout Of LMG1020-Q1 And A Feed-Through Decoupling Capacitor With A Capacitor Load