ZHCSJE7A March   2019  – September 2019 LM76202-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      24V 条件下的 ISO16750-2 负载突降脉冲 5b 性能
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. Table 1. Thermal Information
    5. 6.4      Electrical Characteristics
    6. 6.5      Timing Requirements
    7. 6.6      Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Overvoltage Protection (OVP)
      3. 8.3.3 Reverse Battery Protection
      4. 8.3.4 Hot Plug-In and In-Rush Current Control
      5. 8.3.5 Overload and Short Circuit Protection
        1. 8.3.5.1 Overload Protection
          1. 8.3.5.1.1 Active Current Limiting
          2. 8.3.5.1.2 Electronic Circuit Breaker with Overload Timeout, MODE = OPEN
        2. 8.3.5.2 Short Circuit Protection
          1. 8.3.5.2.1 Start-Up With Short-Circuit On Output
        3. 8.3.5.3 FAULT Response
          1. 8.3.5.3.1 Look Ahead Overload Current Fault Indicator
        4. 8.3.5.4 Current Monitoring
        5. 8.3.5.5 IN, OUT, RTN and GND Pins
        6. 8.3.5.6 Thermal Shutdown
        7. 8.3.5.7 Low Current Shutdown Control (SHDN)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step by Step Design Procedure
        2. 9.2.2.2 Setting Undervoltage Lockout and Overvoltage Set Point for Operating Voltage Range
        3. 9.2.2.3 Programming the Current-Limit Threshold—R(ILIM) Selection
        4. 9.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 9.2.2.5 Limiting the Inrush Current
          1. 9.2.2.5.1 Selection of Input TVS for Transient Protection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1 Layout Guidelines

  • For all the applications, a 0.1 µF or higher value ceramic decoupling capacitor is recommended between IN terminal and GND. Use CIN ≥ 1 µF for automotive transient protection. See Transient Protection.
  • The optimum placement of decoupling capacitor is closest to the IN and GND terminals of the device. Care must be taken to minimize the loop area formed by the bypass-capacitor connection, the IN terminal, and the GND terminal of the device. See Figure 49 for PCB layout example with HTSSOP package.
  • High current carrying power path connections must be as short as possible and must be sized to carry atleast twice the full-load current.
  • RTN, which is the reference ground for the device must be a copper plane or island.
  • Locate all the device support components R(ILIM), C(dVdT), R(IMON), and MODE, UVLO, OVP resistors close to their connection pin. Connect the other end of the component to the RTN with shortest trace length.
  • The trace routing for the RILIM and R(IMON) components to the device must be as short as possible to reduce parasitic effects on the current limit and current monitoring accuracy. These traces must not have any coupling to switching signals on the board.
  • Protection devices such as TVS, snubbers, capacitors, or diodes must be placed physically close to the device they are intended to protect, and routed with short traces to reduce inductance. For example, a protection Schottky diode is recommended to address negative transients due to switching of inductive loads, and it must be physically close to the OUT and GND pins.
  • Thermal Considerations: When properly mounted, the PowerPAD package provides significantly greater cooling ability. To operate at rated power, the PowerPAD must be soldered directly to the board RTN plane directly under the device. Other planes, such as the bottom side of the circuit board can be used to increase heat sinking in higher current applications. Designs that do not need reverse input polarity protection can have RTN, GND and PowerPAD connected together. PowerPAD in these designs can be connected to the PCB ground plane.