ZHCSJE7A March   2019  – September 2019 LM76202-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
      2.      24V 条件下的 ISO16750-2 负载突降脉冲 5b 性能
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. Table 1. Thermal Information
    5. 6.4      Electrical Characteristics
    6. 6.5      Timing Requirements
    7. 6.6      Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Overvoltage Protection (OVP)
      3. 8.3.3 Reverse Battery Protection
      4. 8.3.4 Hot Plug-In and In-Rush Current Control
      5. 8.3.5 Overload and Short Circuit Protection
        1. 8.3.5.1 Overload Protection
          1. 8.3.5.1.1 Active Current Limiting
          2. 8.3.5.1.2 Electronic Circuit Breaker with Overload Timeout, MODE = OPEN
        2. 8.3.5.2 Short Circuit Protection
          1. 8.3.5.2.1 Start-Up With Short-Circuit On Output
        3. 8.3.5.3 FAULT Response
          1. 8.3.5.3.1 Look Ahead Overload Current Fault Indicator
        4. 8.3.5.4 Current Monitoring
        5. 8.3.5.5 IN, OUT, RTN and GND Pins
        6. 8.3.5.6 Thermal Shutdown
        7. 8.3.5.7 Low Current Shutdown Control (SHDN)
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step by Step Design Procedure
        2. 9.2.2.2 Setting Undervoltage Lockout and Overvoltage Set Point for Operating Voltage Range
        3. 9.2.2.3 Programming the Current-Limit Threshold—R(ILIM) Selection
        4. 9.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 9.2.2.5 Limiting the Inrush Current
          1. 9.2.2.5.1 Selection of Input TVS for Transient Protection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

TA = 25 °C, V(IN) = 12 V, V(SHDN)= 2 V, R(ILIM) = 120 kΩ, IMON = FLT = OPEN, C(IN) = 0.1 μF, C(OUT) = 1 μF, C(dVdT) = OPEN. (Unless otherwise noted)
LM76202-Q1 D001_SLVSEM1.gif
Figure 1. POR Threshold (VPOR) vs Temperature
LM76202-Q1 D003_SLVSEM1.gif
Figure 3. Supply Current OFF (IQOFF) vs Supply Voltage (VIN)
LM76202-Q1 D005_SLVSEM1.gif
Figure 5. OVP Thresholds (VOVPR, VOVPF) vs Temperature
LM76202-Q1 D007_SLVSEM1.gif
Figure 7. ILIM vs RILIM
LM76202-Q1 D009_SLVSEM1.gif
Figure 9. ILIM Accuracy vs Temperature with VIN = 12 V
LM76202-Q1 D011_SLVSEM1.gif
Figure 11. IMON vs IOUT
LM76202-Q1 D013_SLVSEM1.gif
V(OUT) = 24 V V(IN) = 0 V VSHDN = 0 V
Figure 13. Ilkg(OUT) vs Temperature with VIN = 0 V
LM76202-Q1 D015_SLVSEM1.gif
Figure 15. VREVTH vs Temperature
LM76202-Q1 D017_SLVSEM1.gif
Figure 17. ILIM Accuracy vs Temperature with VIN = 24 V
LM76202-Q1 D002_SLVSEM1.gif
Figure 2. Supply Current ON (IQON) vs Supply Voltage (VIN)
LM76202-Q1 D004_SLVSEM1.gif
Figure 4. UVLO Thresholds (VUVLOR, VUVLOF) vs Temperature
LM76202-Q1 D006_SLVSEM1.gif
Figure 6. GAIN(dVdT) vs Temperature
LM76202-Q1 D008_SLVSEM1.gif
TA = -40 to 125 °C
Figure 8. ILIM Accuracy vs Supply Voltage
LM76202-Q1 D010_SLVSEM1.gif
Figure 10. GAIN(IMON) vs Temperature
LM76202-Q1 D012_SLVSEM1.gif
Figure 12. RON vs Temperature
LM76202-Q1 D014_SLVSEM1.gif
V(OUT) = 0 V V(IN) = –24 V VSHDN = 0 V
Figure 14. Ilkg(OUT) vs Temperature with VIN = –24 V
LM76202-Q1 D016_SLVSEM1.gif
Figure 16. VFWDTH vs Temperature
LM76202-Q1 D018_SLVSEM1.gif
Taken on 2-layer PCB with 0.07-mm thick copper and copper area of 10.5 cm2 connected to PowerPAD.
Figure 18. Thermal Shutdown Time vs Power Dissipation