ZHCSLD0B
May 2020 – June 2021
LM62435-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
计时特性
7.7
Systems Characteristics
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
EN Uses for Enable and VIN UVLO
8.3.2
MODE/SYNC Pin Operation
8.3.2.1
Level-Dependent MODE/SYNC Pin Control
8.3.2.2
Pulse-Dependent MODE/SYNC Pin Control
8.3.2.3
Clock Locking
8.3.3
PGOOD Output Operation
8.3.4
Internal LDO, VCC UVLO, and BIAS Input
8.3.5
Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
8.3.6
Adjustable SW Node Slew Rate
8.3.7
Spread Spectrum
8.3.8
Soft Start and Recovery From Dropout
8.3.9
Output Voltage Setting
8.3.10
Overcurrent and Short Circuit Protection
8.3.11
Thermal Shutdown
8.3.12
Input Supply Current
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
8.4.3.1
CCM Mode
8.4.3.2
Auto Mode - Light Load Operation
8.4.3.2.1
Diode Emulation
8.4.3.2.2
Frequency Reduction
8.4.3.3
FPWM Mode - Light Load Operation
8.4.3.4
Minimum On-time (High Input Voltage) Operation
8.4.3.5
Dropout
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Choosing the Switching Frequency
9.2.2.2
Setting the Output Voltage
9.2.2.3
Inductor Selection
9.2.2.4
Output Capacitor Selection
9.2.2.5
Input Capacitor Selection
9.2.2.6
BOOT Capacitor
9.2.2.7
BOOT Resistor
9.2.2.8
VCC
9.2.2.9
BIAS
9.2.2.10
CFF and RFF Selection
9.2.2.11
External UVLO
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Ground and Thermal Considerations
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RJR|14
MPQF507D
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsld0b_oa
zhcsld0b_pm
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。