SNOSB43C September   2011  – November 2016 LM3560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Specifications (SCL, SDA)
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Amplifier Synchronization (Tx1)
        1. 7.3.1.1 TX1 Shutdown
      2. 7.3.2 Independent LED Control
      3. 7.3.3 Hardware Torch
      4. 7.3.4 Fault Protections
        1. 7.3.4.1 Overvoltage Protection
        2. 7.3.4.2 Current Limit
        3. 7.3.4.3 Flash Timeout
        4. 7.3.4.4 Indicator LED/Thermistor (LED1/NTC)
          1. 7.3.4.4.1 Message Indicator Current Source (LEDI/NTC)
            1. 7.3.4.4.1.1 Message Indicator Example 1 (Single Pulse With Dead Time):
            2. 7.3.4.4.1.2 Message Indicator Example 2 (Multiple Pulses With Dead Time):
          2. 7.3.4.4.2 Updating The Message Indicator
      5. 7.3.5 Input Voltage Monitor
        1. 7.3.5.1 Input Voltage Flash Monitor (Flash Current Rising)
      6. 7.3.6 Last Flash Register
      7. 7.3.7 LED Voltage Monitor
      8. 7.3.8 ADC Delay
      9. 7.3.9 Flags Register and Fault Indicators
        1. 7.3.9.1 Flash Timeout
        2. 7.3.9.2 Thermal Shutdown
        3. 7.3.9.3 LED Fault
        4. 7.3.9.4 TX1 and TX2 Interrupt Flags
        5. 7.3.9.5 LED Thermal Fault (NTC Flag)
        6. 7.3.9.6 VIN Flash Monitor Fault
        7. 7.3.9.7 VIN Monitor Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1  Start-Up (Enabling the Device)
      2. 7.4.2  Pass Mode
      3. 7.4.3  Flash Mode
      4. 7.4.4  Torch Mode
      5. 7.4.5  Privacy Indicator Mode
      6. 7.4.6  GPIO1 Mode
      7. 7.4.7  TX2/INT/GPIO2
      8. 7.4.8  TX2 Mode
        1. 7.4.8.1 TX2 Shutdown
      9. 7.4.9  GPIO2 Mode
      10. 7.4.10 Interrupt Output (INT Mode)
      11. 7.4.11 NTC Mode
      12. 7.4.12 Alternate External Torch (AET) Mode
      13. 7.4.13 Automatic Conversion Mode
      14. 7.4.14 Manual Conversion Mode
    5. 7.5 I2C-Compatible Interface
      1. 7.5.1 START and STOP Conditions
      2. 7.5.2 I2C-Compatible Chip Address
      3. 7.5.3 Transferring Data
    6. 7.6 Register Descriptions
      1. 7.6.1  Enable Register (Address 0x10)
      2. 7.6.2  Privacy Register (Address 0x11)
      3. 7.6.3  Indicator Register (Address 0x12)
      4. 7.6.4  Indicator Blinking Register (Address 0x13)
      5. 7.6.5  Privacy PWM Period Register (Address 0x14)
      6. 7.6.6  GPIO Register (Address 0x20)
      7. 7.6.7  LED Forward Voltage ADC (VLED Monitor Register, Address 0x30)
      8. 7.6.8  ADC Delay Register (Address 0x31)
      9. 7.6.9  VIN Monitor Register (Address 0x80)
      10. 7.6.10 Last Flash Register (Address 0x81)
      11. 7.6.11 Torch Brightness Register Descriptions (Address 0xA0)
      12. 7.6.12 Flash Brightness Register (Address 0xB0)
      13. 7.6.13 Flash Duration Register (Address 0xC0)
      14. 7.6.14 Flags Register (Address 0xD0)
      15. 7.6.15 Configuration Register 1 (Address 0xE0)
      16. 7.6.16 Configuration Register 2 (Address 0xF0)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LM3560 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Capacitor Selection
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Inductor Selection
      2. 8.2.2 NTC Thermistor Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Recommendations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For additional information, see the following:

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates — go to the product folder for your device on ti.com. In the upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.