SNVS569C May   2009  – October 2016 LM3550

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 STROBE Pin
      2. 7.3.2 End-of-Charge Pin (EOC)
      3. 7.3.3 ALD/TEMP Pin
      4. 7.3.4 IND Pin
      5. 7.3.5 BAL Pin
      6. 7.3.6 Super-Capacitor Charging Time
      7. 7.3.7 Super-Capacitor Voltage Profile
      8. 7.3.8 Peak Flash Current
      9. 7.3.9 Maximum Flash Duration
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Machine Description
        1. 7.4.1.1 Basic Description
        2. 7.4.1.2 Shutdown State
        3. 7.4.1.3 Torch State
        4. 7.4.1.4 Charge State
          1. 7.4.1.4.1 Fixed-Voltage-Charge Mode
          2. 7.4.1.4.2 Optimal Charge Mode
        5. 7.4.1.5 Torch and Charge State
        6. 7.4.1.6 Flash State
        7. 7.4.1.7 EOC Functionality
        8. 7.4.1.8 State Diagram FGATE = 1
        9. 7.4.1.9 Optimal Charge Mode vs Fixed Voltage Mode
          1. 7.4.1.9.1 Optimal Charge Mode vs Fixed Voltage Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Child Address: 0x53
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
        1. 7.6.1.1 General Purpose Register Description
        2. 7.6.1.2 Current Control Register Description
        3. 7.6.1.3 Options Control Register Description
        4. 7.6.1.4 ALD/TEMP Sense High/Low Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Super-Capacitor
          2. 8.2.2.1.2 Boost Capacitors
          3. 8.2.2.1.3 Current Source FET
          4. 8.2.2.1.4 ALD/TEMP Components
            1. 8.2.2.1.4.1 NTC Selection
            2. 8.2.2.1.4.2 Ambient Light Sensor
          5. 8.2.2.1.5 Thermal Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
VIN to GND –0.3 6 V
VOUT, LED−, FB to GND –0.3 6 V
SDA, SCL, STROBE, FET_CON, EOC, ALD/TEMP, IND to GND –0.3 6 V
Continuous power dissipation(4) Internally limited
Junction temperature, TJ-MAX 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 145°C (typical) and disengages at TJ = 125°C (typical). The thermal shutdown is specified by design.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine model(2) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The LED pin has a machine model ESD rating of 150 V.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
Input voltage 2.7 5.5 V
Junction temperature, TJ –30 125 °C
Ambient temperature, TA –30 85 °C
(1) All voltages are with respect to the potential at the GND pin.

6.4 Thermal Information

THERMAL METRIC(1) LM3550 UNIT
NHU (UQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 60.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.5 °C/W
RθJB Junction-to-board thermal resistance 28.1 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 28.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 17.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Typical imits are for TJ = 25°C; minimum and maximum limits apply over the full ambient junction temperature range (−30°C ≤ TA ≤ 85°C). Unless otherwise noted, specifications apply to Typical Application with: : VIN = 3.6 V, CIN = 4.7 µF, COUT = 2.2 µF, C1 = C2 = 1 µF.(1)(2)
PARAMETER TEST CONDITION MIN(3) TYP MAX(3) UNIT
ILED– Current sink accuracy 2.7 V ≤ VIN ≤ 5.5 V
3 V ≤ VIN ≤ 5.5 V		 54 60 66 mA
90 100 110
180 200 220
VOVP Output overvoltage protection 2.7 V ≤ VIN ≤ 5.5 V Going into OVP 5.3 5.479 V
Hysteresis 0.2
VOUT Output voltage regulation 2.7 V ≤ VIN ≤ 5.5 V, IOUT = 0 mA 4.275 4.5 4.666 V
4.75 5 5169
5.035 5.3 5.479
VBAL BAL pin voltage regulation 2.7 V ≤ VIN ≤ 5.5 V VOUT / 2
IIND IND pin current regulation 2.7 V ≤ VIN ≤ 5.5 V, VIND = 2 V 3.3 4.8 6.3 mA
ƒSW Switching frequency 2.7 V ≤ VIN ≤ 5.5 V 0.882 1 1.153 MHz
VFB FEEDBACK pin regulation voltage 2.7 V ≤ VIN ≤ 5.5 V, VOUT = 4.6 V 94 100 106 mV
VALD/TEMP ALD/TEMP pin reference voltage 2.7 V ≤ VIN ≤ 5.5 V 095 1 1.05 V
VEOC EOC pin output logic load ILOAD = 3 mA 400 mV
IIN-CL Input current limit VOUT = 0 V 534 610 mA
ISD Shutdown supply current Device disabled, 2.7 V ≤ VIN ≤ 5.5 V 1.8 4 µA
IQ Quiescent supply current 2.7 V ≤ VIN ≤ 5.5 V, IOUT = 0 mA
5-V charge mode, non switching		 168 240 µA
VSTROBE STROBE logic thresholds 2.7 V ≤ VIN ≤ 5.5 V High 1.23 VIN V
Low 0 0.7
I2C-COMPATIBLE VOLTAGE SPECIFICATIONS (SCL, SDA)
VIL Input logic low 2.7 V ≤ VIN ≤ 5.5 V 0 0.7 V
VIH Input logic high 2.7 V ≤ VIN ≤ 5.5 V 1.23 VIN V
VOL Output logic low ILOAD = 3 mA 400 mV
(1) All voltages are with respect to the potential at the GND pin.
(2) Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm × 76 mm × 1.6 mm with a 2 × 1 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1 W.
(3) Minimum (MIN) and maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not ensured, but do represent the most likely norm. Unless otherwise specified, conditions for TYP specifications are: VIN = 3.6 V and TA = 25°C.

6.6 Timing Requirements

MIN NOM MAX UNIT
t1 SCK (clock period) 294 ns
t2 Data in setup time to SCL high, ƒSCL = 400 kHz 100 ns
t3 Data out stable after SCL low, ƒSCL = 400 kHz 0 ns
t4 SDA low setup time to SCL low (start), fSCL = 400 kHz 100 ns
t5 SDA igh hold time after SCL high (stop), fSCL = 400 kHz 100 ns
LM3550 30059411.png Figure 1. LM3550 Timing

6.7 Typical Characteristics

Unless otherwise specified: TA = 25°C; VIN = 3.6 V; CIN = 4.7 µF, COUT = 2.2 µF, C1 = C2 = 1 µF. Super capacitor = 0.5 F TDK EDLC272020-501-2F-50.
LM3550 30059438.gif
5-V Mode, Tri-Temp
Figure 2. Output Voltage vs Output Current
LM3550 30059439.gif
5.3-V Mode, Tri-Temp
Figure 4. Output Voltage vs Output Current
LM3550 30059436.gif
5.3-V Mode
Figure 3. Output Voltage vs Output Current
LM3550 30059435.gif
5-V Mode
Figure 5. Output Voltage vs Output Current
LM3550 30059434.gif
4.5-V Mode
Figure 6. Output Voltage vs Output Current
LM3550 30059422.gif
Figure 8. Input Current Limit vs Output Voltage
LM3550 30059469.gif
5.3-V Mode
Figure 10. Converter Efficiency vs Input Voltage
LM3550 30059431.gif
Figure 12. Torch Current vs Input Voltage Code = 0
LM3550 30059429.gif
Figure 14. Torch Current vs Input Voltage Code = 2
LM3550 30059427.gif
Figure 16. Torch Current vs Input Voltage Code = 4
LM3550 30059425.gif
Figure 18. Torch Current vs Input Voltage Code = 6
LM3550 30059432.gif
Figure 20. Torch Current vs Input Voltage Different VLED
LM3550 30059440.gif
Figure 22. Oscillator Frequency vs Input Voltage
LM3550 30059454.gif
Figure 24. Indicator Current vs Input Voltage Different VLED
LM3550 30059442.gif
Figure 26. 5.3-V Mode Super Capacitor Charge
LM3550 30059444.gif
Figure 28. 5.3-V Mode Super Capacitor Recharge
LM3550 30059449.gif
Figure 30. Edge-Sensitive Strobe
LM3550 30059451.gif
Figure 32. Flash With FGATE = 0
LM3550 30059446.gif
VALS = 100 mV
Figure 34. ALS Detect Zone 0
LM3550 30059448.gif
VALS = 1 V
Figure 36. ALS Detect Zone 2
LM3550 30059437.gif
4.5-V Mode, Tri-Temp
Figure 7. Output Voltage vs Output Current
LM3550 30059423.gif
Figure 9. Input Current Limit vs Output Voltage Tri-Temp
LM3550 30059433.gif
Figure 11. Torch Current vs Brightness Code
LM3550 30059430.gif
Figure 13. Torch Current vs Input Voltage Code = 1
LM3550 30059428.gif
Figure 15. Torch Current vs Input Voltage Code = 3
LM3550 30059426.gif
Figure 17. Torch Current vs Input Voltage Code = 5
LM3550 30059424.gif
Figure 19. Torch Current vs Input Voltage Code = 7
LM3550 30059441.gif
Figure 21. Feedback Voltage vs Input Voltage
LM3550 30059453.gif
Figure 23. Shutdown Current vs Input Voltage
LM3550 30059455.gif
Figure 25. Indicator Current vs Input Voltage Tri-Temp
LM3550 30059443.gif
Figure 27. 2 LED, 3-A Flash (1.5 A Each)
LM3550 30059445.gif
Figure 29. Strobe-to-Flash Delay
LM3550 30059450.gif
Figure 31. Level-Sensitive Strobe
LM3550 30059452.gif
Figure 33. Flash With FGATE = 1
LM3550 30059447.gif
VALS = 500 mV
Figure 35. ALS Detect Zone 1