SNVS541H October   2007  – August 2016 LM3410 , LM3410-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 DIM Pin and Shutdown Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Boost Converter
        1. 8.1.1.1 Setting the LED Current
        2. 8.1.1.2 LED-Drive Capability
        3. 8.1.1.3 Inductor Selection
        4. 8.1.1.4 Input Capacitor
        5. 8.1.1.5 Output Capacitor
        6. 8.1.1.6 Diode
        7. 8.1.1.7 Output Overvoltage Protection
      2. 8.1.2 SEPIC Converter
        1. 8.1.2.1 SEPIC Equations
        2. 8.1.2.2 Steady State Analysis with Loss Elements
          1. 8.1.2.2.1 Details
    2. 8.2 Typical Applications
      1. 8.2.1  Low Input Voltage, 1.6-MHz, 3 to 5 White LED Output at 50-mA Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Set the LED Current (R1)
          2. 8.2.1.2.2 Calculate Maximum Duty Cycle (DMAX)
          3. 8.2.1.2.3 Calculate the Inductor Value (L1)
          4. 8.2.1.2.4 Calculate the Output Capacitor (C2)
          5. 8.2.1.2.5 Input Capacitor (C1) and Schottky Diode (D1)
        3. 8.2.1.3 Application Curves
      2. 8.2.2  LM3410X SOT-23: 5 × 1206 Series LED String Application
        1. 8.2.2.1 Design Requirements
      3. 8.2.3  LM3410Y SOT-23: 5 × 1206 Series LED String Application
        1. 8.2.3.1 Design Requirements
      4. 8.2.4  LM3410X WSON: 7 × 5 LED Strings Backlighting Application
        1. 8.2.4.1 Design Requirements
      5. 8.2.5  LM3410X WSON: 3 × HB LED String Application
        1. 8.2.5.1 Design Requirements
      6. 8.2.6  LM3410Y SOT-23: 5 × 1206 Series LED String Application With OVP
        1. 8.2.6.1 Design Requirements
      7. 8.2.7  LM3410X SEPIC WSON: HB or OLED Illumination Application
        1. 8.2.7.1 Design Requirements
      8. 8.2.8  LM3410X WSON: Boost Flash Application
        1. 8.2.8.1 Design Requirements
      9. 8.2.9  LM3410X SOT-23: 5 × 1206 Series LED String Application With VIN > 5.5 V
        1. 8.2.9.1 Design Requirements
      10. 8.2.10 LM3410X WSON: Camera Flash or Strobe Circuit Application
        1. 8.2.10.1 Design Requirements
      11. 8.2.11 LM3410X SOT-23: 5 × 1206 Series LED String Application With VIN and VPWR Rail > 5.5 V
        1. 8.2.11.1 Design Requirements
      12. 8.2.12 LM3410X WSON: Boot-Strap Circuit to Extend Battery Life
        1. 8.2.12.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Design
      2. 10.3.2 LM3410 and LM3410-Q1 Thermal Models
      3. 10.3.3 Calculating Efficiency and Junction Temperature
        1. 10.3.3.1 Quiescent Power Losses
        2. 10.3.3.2 RSET Power Losses
      4. 10.3.4 Example Efficiency Calculation
      5. 10.3.5 Calculating RθJA and RΨJC
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

5 Pin Configuration and Functions

NGG Package
6-Pin WSON
Top View
DGN Package
8-Pin MSOP-PowerPad
Top View
DBV Package
5-Pin SOT-23
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME WSON MSOP-PowerPAD SOT-23
AGND 5 6 — — Signal ground pin. Place the bottom resistor of the feedback network as close as possible to this pin and FB.
DIM 3 4 4 I Dimming and shutdown control input. Logic high enables operation. Duty Cycle from 0% to 100%. Do not allow this pin to float or be greater than VIN + 0.3 V.
FB 4 5 3 I Feedback pin. Connect FB to external resistor to set output current.
GND DAP DAP — — Die attach pad. Signal and Power ground. Connect to PGND and AGND on top layer. Place 4 to 6 vias from DAP to bottom layer GND plane.
— — 2 — Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin.
NC — 1, 8 — — No connection
PGND 1 2 — — Power ground pin. Place PGND and output capacitor GND close together.
SW 6 7 1 O Output switch. Connect to the inductor, output diode.
VIN 2 3 5 I Supply voltage pin for power stage, and input supply voltage.