ZHCSHH4L March 2000 – January 2018 LM317L-N
PRODUCTION DATA.
| THERMAL METRIC(1) | LM317L-N | UNIT | ||||
|---|---|---|---|---|---|---|
| TO-92 | SOIC | DSBGA | ||||
| 3 PINS | 8 PINS | 6 PINS | ||||
| 0.4-in Leads | 0.125-in Leads | |||||
| RθJA | Junction-to-ambient thermal resistance | 180 | 160 | 165 | 290 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | — | 80.6 | — | — | °C/W |
| RθJB | Junction-to-board thermal resistance | — | — | — | — | °C/W |
| ψJT | Junction-to-top characterization parameter | — | 24.7 | — | — | °C/W |
| ψJB | Junction-to-board characterization parameter | — | 135.8 | — | — | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | °C/W |