ZHCSFU6E November   2016  – August 2023 ISO7730-Q1 , ISO7731-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|16
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (October 2020) to Revision E (August 2023)

  • 将整个文档中的标准名称从“DIN V VDE V 0884-11:2017-01”更改为“DIN EN IEC 60747-17 (VDE 0884-17)”Go
  • 通篇删除了所有标准名称中的标准版本和年份参考Go
  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated electrical and switching characteristics to match device performanceGo
  • Changed working voltage lifetime margin from: 87.5% to: 50%, minimum required insulation lifetime from: 37.5 years to: 30 years and insulation lifetime per TDDB from: 135 years to: 169 years per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Changed Figure 9-8 per DIN EN IEC 60747-17 (VDE 0884-17Go

Changes from Revision C (March 2020) to Revision D (October 2020)

  • 在节 1中添加了“功能安全”要点Go

Changes from Revision B (September 2018) to Revision C (March 2020)

  • 通篇进行了编辑性和修饰性更改Go
  • 将“隔离栅寿命：超过 40 年”更改为“在 1500VRMS 工作电压下预计寿命超过 100 年”（位于节 1）Go
  • 在节 1中添加了“隔离等级高达 5000VRMS”Go
  • 在节 1中添加了“浪涌能力高达 12.8kV”Go
  • 在节 1中添加了“在整个隔离栅具有 ±8kV IEC 61000-4-2 接触放电保护”Go
  • 将 UL 认证要点从“符合 UL 1577 的 5000VRMS (DW) 和 2500VRMS (DBQ) 隔离额定值”更改为“UL 1577 组件认证计划”（在节 1中）Go
  • 删除了节 1中的“除 DBQ-16 封装器件的 CQC 认证外，所有认证均已完成”要点Go
  • 更新了节 2部分的应用列表Go
  • 更新了图 3-1，以便显示每个通道的两个串联隔离电容器，而不是单个隔离电容器Go
  • Added "Contact discharge per IEC 61000-4-2" specification of ±8000 V in Section 6.2 tableGo
  • Added the following table note to Data rate specification in Section 6.3 table: "100 Mbps is the maximum specified data rate, although higher data rates are possible." Go
  • Changed VIORM value for DW-16 package From: "1414 VPK" To: "2121 VPK" in Section 6.6 table Go
  • Changed VIOWM value for DW-16 package AC voltage From: "1000 VRMS" To: "1500 VRMS" and DC voltage From: "1414 VDC" To: "2121 VDC" in Section 6.6 table Go
  • Added 'see Figure 9-8' to TEST CONDITIONS of VIOWM specification in Section 6.6 Go
  • Changed VIOSM TEST CONDITIONS From: "Test method per IEC 60065" To: "Test method per IEC 62368-1" in Section 6.6 tableGo
  • Updated certification information in Section 6.7 table Go
  • Corrected ground symbols for "Input (Devices with F suffix)" in Section 8.4.1 Go
  • Added Section 9.2.3.1 sub-section under Section 9.2.3 sectionGo
  • Added 'How to use isolation to improve ESD, EFT, and Surge immunity in industrial systems' application report to Section 12.1 section Go

Changes from Revision A (May 2017) to Revision B (June 2018)

  • 通篇更改了 DIN 认证编号和认证状态Go
  • 将 DBQ 封装的隔离等级从 2500VRMS 更改为 3000VRMS Go
  • Moved the HBM and CDM values from the Features section to the ESD Ratings tableGo
  • Added VTEST to the conditions for the maximum transient isolation voltage parameter in the Insulation Specifications tableGo
  • Changed the value for the DBQ package from 3600 VPK to 4242 VPK throughout the documentGo
  • Changed the method b1 Vini condition for apparent charge in the Insulation Specifications tableGo

Changes from Revision * (November 2016) to Revision A (May 2017)

  • Updated the Safety-Related Certifications tableGo
  • Changed the minimum CMTI from 40 to 85 in all Electrical Characteristics tables Go