ZHCSE44C august   2015  – may 2023 ISO5852S

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Function
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and Active Miller Clamp
      2. 9.3.2 Active Output Pulldown
      3. 9.3.3 Undervoltage Lockout (UVLO) With Ready (RDY) Pin Indication Output
      4. 9.3.4 Soft Turnoff, Fault ( FLT) and Reset ( RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5852S Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方产品免责声明
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 静电放电警告
    7. 13.7 术语表
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision B (January 2017) to Revision C (May 2023)

  • Added Additional manufacturing certification pending to Safety-Related Certifications tableGo

Changes from Revision A (September 2015) to Revision B (January 2017)

  • 将数据表标题从有源安全特性 更改为有源保护特性 Go
  • 将“特性”从“浪涌抗扰度为 12800VPK（根据 IEC 61000-4-5）”更改为“可承受的隔离浪涌电压 12800VPK”Go
  • Changed the minimum external tracking (creepage) parameter to the external creepage parameterGo
  • Changed the input-to-output test voltage parameter to the apparent charge parameterGo
  • Added the climatic category to the Insulation Specifications tableGo
  • Changed the CSA status from planned to certifiedGo
  • Added text ", but connecting CLAMP output of the gate driver to the IGBT gate is also not an issue." to Supply and Active Miller Clamp Go
  • Changed the second paragraph of the Typical Applications Go
  • Added text "and RST input signal" to the Design Requirements Go

Changes from Revision * (July 2015) to Revision A (September 2015)

  • 将特性 部分的“100kV/μs 最小共模瞬态抗扰度...”移至列表顶部Go
  • 将首页的“产品预发布”更改为完整数据表Go
  • 将说明 中的文本“3V 至 5.5V 的单电源”更改为“2.25V 至 5.5V 的单电源”Go
  • 将说明 中的文本“IGBT 处于过载状态”更改为“IGBT 处于过流状态”Go
  • 将说明 中的文本“并在最短 2μs 的时间跨度内降低 OUTL 上的电压”更改为“并在 2μs 的时间跨度内将 OUTL 拉至低电平”Go
  • 更改了功能方框图，在引脚 OUTL 上添加了 STOGo
  • 更改了说明 的第 3 段Go
  • Changed the minimum air gap (clearance) parameter to the external clearance parameterGo