ZHCSID3E September   1997  – June 2018 ISO124

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Modulator
      2. 7.1.2 Demodulator
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Isolation Amplifier
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Carrier Frequency Considerations
      2. 8.1.2 Isolation Mode Voltage Induced Errors
      3. 8.1.3 High IMV dV/dt Errors
      4. 8.1.4 High Voltage Testing
    2. 8.2 Typical Applications
      1. 8.2.1 Output Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Battery Monitor
      3. 8.2.3 Programmable Gain Amplifier
      4. 8.2.4 Thermocouple Amplifier
      5. 8.2.5 Isolated 4-mA to 20-mA Instrument Loop
      6. 8.2.6 Single-Supply Operation of the ISO124 Isolation Amplifier
      7. 8.2.7 Input-Side Powered ISO Amplifier
      8. 8.2.8 Powered ISO Amplifier With Three-Port Isolation
  9. 9 Power Supply Recommendations
    1. 9.1 Signal and Supply Connections
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NVF|8
  • DVA|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (July 2016) to E Revision

  • Changed 将 16 引脚 SOIC 封装更改为 16 引脚 PDIP 封装，以便与数据表最后的封装选项附录中显示的产品相匹配Go
  • Changed DVA and NVF pin configuration labels to match content shown in the package option addendum at the end of the data sheetGo
  • Changed parameter name from "vs temperature" to "Input offset drift" in Electrical Characteristics tableGo
  • Changed parameter name from "vs power supply" to "Power-supply rejection ratio" in Electrical Characteristics tableGo
  • Changed location of supply voltage specifications from the Electrical Characteristics table to the Recommended Operating Conditions tableGo
  • Changed parameter name from "Quiescent current" to "High-side analog supply current", and changed symbol from "VS1" to "IVS1" in Electrical Characteristics tableGo
  • Changed parameter name from "Quiescent current" to "Low-side analog supply current", and changed symbol from "VS2" to "IVS2" in Electrical Characteristics tableGo
  • Changed location of Temperature specifications from the Electrical Characteristics table to the Recommended Operating Conditions tableGo
  • Deleted Thermal resistance parameters from Electrical Characteristics table; see Thermal Information tableGo

Changes from C Revision (September 2005) to D Revision

  • Added 增加了 ESD 额定值表、特性 说明 部分、器件功能模式、应用和实施 部分、电源建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分。Go