ZHCSJH3A March   2019  – November 2023 INA185

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 High Bandwidth and Slew Rate
      2. 6.3.2 Bidirectional Current Monitoring
      3. 6.3.3 Wide Input Common-Mode Voltage Range
      4. 6.3.4 Precise Low-Side Current Sensing
      5. 6.3.5 Rail-to-Rail Output Swing
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Mode
      2. 6.4.2 Unidirectional Mode
      3. 6.4.3 Bidirectional Mode
      4. 6.4.4 Input Differential Overload
      5. 6.4.5 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Connections
      2. 7.1.2 RSENSE and Device Gain Selection
      3. 7.1.3 Signal Filtering
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Common-Mode Transients Greater Than 26 V
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) INA185 UNIT
DCK (SC70) DRL (SOT-563)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 188.0 230.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 140.8 94.1 °C/W
RθJB Junction-to-board thermal resistance 78.8 112.8 °C/W
ψJT Junction-to-top characterization parameter 62.1 3.8 °C/W
ψJB Junction-to-board characterization parameter 78.5 112.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.