ZHCSTC7A September   2000  – January 2024 INA114

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Setting the Gain
      2. 6.1.2 Noise Performance
      3. 6.1.3 Offset Trimming
      4. 6.1.4 Input Bias Current Return Path
      5. 6.1.5 Input Common-Mode Range
      6. 6.1.6 Input Protection
      7. 6.1.7 Output Voltage Sense (SOIC-16 Package Only)
  8. 7 Typical Applications
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • P|8
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1.7 Output Voltage Sense (SOIC-16 Package Only)

The surface-mount version of the INA114 has a separate output sense feedback connection (pin 12). Pin 12 must be connected to the output terminal (pin 11) for proper operation. (This connection is made internally on the DIP version of the INA114.)

The output sense connection can be used to sense the output voltage directly at the load for best accuracy. Figure 6-5 shows how to drive a load through series interconnection resistance. Remotely located feedback paths can cause instability. This instability can be generally be eliminated with a high-frequency feedback path through C1. Drive heavy loads or long lines by connecting a buffer inside the feedback path (see Figure 6-6).

GUID-A236B625-1650-4F4E-9ED0-26F6282CEBEA-low.png Figure 6-5 Remote Load and Ground Sensing
GUID-D87FA0DA-68FC-4779-B027-221EEEC4E7AB-low.png Figure 6-6 Buffered Output for Heavy Loads