ZHCSCW0A October   2014  – November 2014 HDC1008

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 典型应用
5. 5 修订历史记录
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 Handling Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 I2C Interface Electrical Characteristics
   7. 7.7 I2C Interface Timing Requirements
   8. 7.8 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Power Consumption
      2. 8.3.2 Voltage Supply Monitoring
      3. 8.3.3 Heater
   4. 8.4 Device Functional Modes
   5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
         1. 8.5.2.1 Serial Bus Address
         2. 8.5.2.2 Read and Write Operations
         3. 8.5.2.3 Device Measurement Configuration
   6. 8.6 Register Map
      1. 8.6.1 Temperature Register
      2. 8.6.2 Humidity Register
      3. 8.6.3 Configuration Register
      4. 8.6.4 Serial Number Registers
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
   3. 9.3 Do's and Don'ts
      1. 9.3.1 Soldering
      2. 9.3.2 Recovery From Soldering
      3. 9.3.3 Chemical Exposure
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Surface Mount
       2. 11.1.2 Stencil Printing Process
    2. 11.2 Layout Example
12. 12器件和文档支持
    1. 12.1 文档支持
       1. 12.1.1 相关文档　
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
13. 13机械封装和可订购信息