ZHCSDQ7 May   2015 HD3SS3212

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 High-Speed Performance Parameters
    7. 8.7 Switching Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Output Enable and Power Savings
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Down Facing Port for USB3.1 Type C
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Up Facing Port for USB3.1 Type C
      3. 11.2.3 PCIE/SATA/USB
      4. 11.2.4 PCIE/eSATA
      5. 11.2.5 USB/eSATA
      6. 11.2.6 MIPI Camera Serial Interface
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14器件和文档支持
    1. 14.1 相关链接
    2. 14.2 社区资源
    3. 14.3 商标
    4. 14.4 静电放电警告
    5. 14.5 术语表
  15. 15机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Device Comparison Table

OPERATING TEMPERATURE (°C) PACKAGE(1)(2) ORDERABLE PART NUMBER
0 to 70 RKS 20 pins HD3SS3212RKSR
–40 to 85 RKS 20 pins HD3SS3212IRKSR
(1) For the most current package and ordering information, see 机械、封装和可订购信息.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.