SLVSIZ2 April   2026 FAN31790

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Power Supply
    6. 5.6 Fan Controller Characteristics
    7. 5.7 External Crystal Parameters
    8. 5.8 Digital IO
      1. 5.8.1 Electrical Characteristics
      2. 5.8.2 Switching Characteristics
    9. 5.9 I2C Characteristics
      1. 5.9.1 I2C Filter
      2. 5.9.2 I2C Timing Diagram
  7. 6 Detailed Description
    1. 6.1 Fan Control
      1. 6.1.1 PWM Mode
      2. 6.1.2 RPM Mode
      3. 6.1.3 Rate-of-Change Control
      4. 6.1.4 Spin-Up
      5. 6.1.5 Sequential Fan Start
      6. 6.1.6 FULL_SPEED Input
      7. 6.1.7 I2C Watchdog Timer
      8. 6.1.8 Power-on Reset Configuration Pins
    2. 6.2 Fan Monitoring
      1. 6.2.1 Tachometer Signals
      2. 6.2.2 PWM Outputs as Tachometer Inputs
    3. 6.3 Fan Faults and Failures
      1. 6.3.1 PWM Mode Failure Detection
      2. 6.3.2 RPM Mode Failure Detection
      3. 6.3.3 Locked Rotor Mode Failure Detection
      4. 6.3.4 Failure Indication
    4. 6.4 I2C Interface
      1. 6.4.1 I2C Addresses and ADDRx Pins
      2. 6.4.2 I2C Command Structure
  8. 7 Register Map
  9. 8 Register Descriptions
    1. 8.1 Global Configuration Registers
    2. 8.2 Fan Fault Registers
    3. 8.3 TACH and PWM Status Registers
    4. 8.4 PWM Duty Cycle Control Registers
    5. 8.5 TACH Target Count Registers
    6. 8.6 Window Registers
  10. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
      2. 9.1.2 Configuration Examples
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZFP|28
散热焊盘机械数据 (封装 | 引脚)

5.4 Thermal Information

THERMAL METRIC(1)PACKAGEVALUEUNIT
RθJA Junction-to-ambient thermal resistanceLGA-28 (ZFP)82.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance

49.2

°C/W
RθJBJunction-to-board thermal resistance

61.9

°C/W
ΨJTJunction-to-top characterization parameter

3.6

°C/W
ΨJBJunction-to-board characterization parameter

61.8

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

48.5

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.