ZHCSMR4A november 2020 – november 2020 DS90UB662-Q1
PRODUCTION DATA
| PIN | I/O TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| MIPI CSI-2 TX INTERFACE | |||
| CSI_CLKN | 22 | O | CSI-2 differential clock output pins. Leave unused pins as No Connect. |
| CSI_CLKP | 23 | ||
| CSI_D0N | 24 | CSI-2 differential data output pins. Use CSI_PORT_SEL
(see Table 7-68), CSI_CTL (see Table 7-69), and CSI_CTL2 (see Table 7-70) registers for the CSI-2 TX control. Leave unused pins as No Connect. | |
| CSI_D0P | 25 | ||
| CSI_D1N | 26 | ||
| CSI_D1P | 27 | ||
| CSI_D2N | 28 | ||
| CSI_D2P | 29 | ||
| CSI_D3N | 30 | ||
| CSI_D3P | 31 | ||
| FPD-LINK III RX INTERFACE | |||
| RIN0+ | 50 | I/O | FPD-Link III RX Port 0 pins. The port receives FPD-Link III high-speed forward channel video and control data and transmits back channel control data. It can interface with a compatible FPD-Link III serializer TX through a STP or coaxial cable (see Figure 8-6 and Figure 8-7). It must be AC-coupled per Table 8-4. If port is unused, set RX_PORT_CTL register bit 0 to 0 to disable RX Port 0 (see Table 7-30) and leave the pins as No Connect. |
| RIN0- | 51 | ||
| RIN1+ | 53 | FPD-Link III RX Port 1 pins. The port receives FPD-Link III high-speed forward channel video and control data and transmits back channel control data. It can interface with a compatible FPD-Link III serializer TX through a STP or coaxial cable (see Figure 8-6 and Figure 8-7). It must be AC-coupled per Table 8-4. If port is unused, set RX_PORT_CTL register bit 1 to 0 to disable RX Port 1 (see Table 7-30) and leave the pins as No Connect. | |
| RIN1- | 54 | ||
| RIN2+ | 59 | FPD-Link III RX Port 2 pins. The port receives FPD-Link III high-speed forward channel video and control data and transmits back channel control data. It can interface with a compatible FPD-Link III serializer TX through a STP or coaxial cable (see Figure 8-6 and Figure 8-7). It must be AC-coupled per Table 8-4. If port is unused, set RX_PORT_CTL register bit 2 to 0 to disable RX Port 2 (See Table 7-30) and leave the pins as No Connect. | |
| RIN2- | 60 | ||
| RIN3+ | 62 | FPD-Link III RX Port 3 pins. The port receives FPD-Link III high-speed forward channel video and control data and transmits back channel control data. It can interface with a compatible FPD-Link III serializer TX through a STP or coaxial cable (see Figure 8-6 and Figure 8-7). It must be AC-coupled per Table 8-4. If port is unused, set RX_PORT_CTL register bit 3 to 0 to disable RX Port 3 (see Table 7-30) and leave the pins as No Connect. | |
| RIN3- | 63 | ||
| SYNCHRONIZATION AND GENERAL-PURPOSE I/O | |||
| GPIO0 | 9 | I/O, PD | General-Purpose Input/Output pins. The pins can be used to control and respond to various commands. They may be configured to be input signals for the corresponding GPIOs on the serializer or they may be configured to be outputs to follow local register settings. At power up, the GPIO pins are disabled and by default include a pulldown resistor (25-kΩ typ). See Section 7.4.11. for programmability. If unused, leave the pin as No Connect. |
| GPIO1 | 10 | ||
| GPIO2 | 14 | ||
| GPIO3 | 15 | ||
| GPIO4 | 17 | ||
| GPIO5 | 18 | ||
| GPIO6 | 19 | ||
| GPIO7 | 20 | ||
| INTB | 6 | O, OD | Interrupt Output pin. INTB is an active-low open drain and controlled by the status registers. See Section 7.5.9. Recommend a 4.7-kΩ Pullup to to 1.8 V or 3.3 V. If unused, leave the pin as No Connect. |
| SERIAL CONTROL BUS (I2C) | |||
| I2C_SCL | 12 | I/O, OD | Primary I2C Clock Input / Output interface pin. See Section 7.5.1. Recommend a 2.2-kΩ to 4.7-kΩ Pullup(1) to 1.8 V or 3.3 V. |
| I2C_SDA | 11 | I/O, OD | Primary I2C Data Input / Output interface pin. See Section 7.5.1. Recommend a 2.2-kΩ to 4.7-kΩ Pullup(1) to 1.8 V or 3.3 V. |
| I2C_SCL2 | 8 | I/O, OD | Secondary I2C Clock Input / Output interface pin. See Section 7.5.2. Recommend a 2.2-kΩ to 4.7-kΩ Pullup(1) to 1.8 V or 3.3 V. |
| I2C_SDA2 | 7 | I/O, OD | Secondary I2C Data Input / Output interface pin. See Section 7.5.2. Recommend a 2.2-kΩ to 4.7-kΩ Pullup(1) to 1.8 V or 3.3 V. |
| CONFIGURATION AND CONTROL | |||
| IDX | 46 | S | I2C Serial Control Bus Device ID Address Select configuration pin. Connect to an external pullup to VDD18 and a pulldown to GND to create a voltage divider. See Table 7-15. |
| MODE | 45 | S | Mode Select configuration pin. Connect to external pullup to VDD18 and a pulldown to GND to create a voltage divider. See Table 7-1. |
| PDB | 3 | I, PD | Inverted Power-Down input pin. Typically connected to a processor GPIO with a pulldown. When PDB input is brought HIGH, the device is enabled and internal registers and state machines are reset to default values. Asserting PDB signal low will power down the device and consume minimum power. The default function of this pin is PDB = LOW; POWER DOWN with an internal 50-kΩ internal pulldown enabled. PDB should remain low until after power supplies are applied and reach minimum required levels. See Section 9.1. INPUT IS 3.3-V TOLERANT PDB = 1.8 V, device is enabled (normal operation) PDB = 0 V, device is powered down. |
| POWER AND GROUND | |||
| VDDIO | 16 | P | 1.8-V (±5%) OR 3.3-V (±10%) LVCMOS I/O Power Requires 1-μF and 0.1-μF or 0.01-μF capacitors to GND. |
| VDD_CSI VDD_CSI | 21 33 | P | 1.1-V (±5%) Power Supplies Requires 0.1-μF or 0.01-μF capacitors to GND at each VDD pin. Additional 1-μF and 10-μF decoupling is recommended for the pin group. |
| VDDL1 VDDL2 | 13 44 | P | 1.1-V (±5%) Power Supplies Requires 0.1-μF or 0.01-μF capacitors to GND at each VDD pin. Additional 1-μF and 10-μF decoupling is recommended for the pin group. |
| VDD_FPD1 VDD_FPD2 | 52 61 | P | 1.1-V (±5%) Power Supplies Requires 0.1-μF or 0.01-μF capacitors to GND at each VDD pin. Additional 1-μF and 10-μF decoupling is recommended for the pin group. |
| VDD18_P2 VDD18_P3 VDD18_P1 VDD18_P0 | 2 1 47 48 | P | 1.8-V (±5%) Power Supplies Requires 0.1-μF or 0.01-μF capacitors to GND at each VDD pin. Additional 1-μF, and 10-μF decoupling is recommended for the pin group. |
| VDD18A | 32 | P | 1.8-V (±5%) Power Supplies Requires 0.1-μF or 0.01-μF capacitors to GND at each VDD pin. Additional 1-μF, and 10-μF decoupling is recommended for the pin group. |
| VDD18_FPD0 VDD18_FPD1 VDD18_FPD2 VDD18_FPD3 | 49 55 58 64 | P | 1.8-V (±5%) Power Supplies Requires 0.1-μF or 0.01-μF capacitors to GND at each VDD pin. Additional 1-μF, and 10-μF decoupling is recommended for the pin group. |
| GND | DAP | G | DAP is the large metal contact at the bottom side, located at the center of the VQFN package. Connect to the ground plane (GND). |
| OTHERS | |||
| REFCLK | 5 | I | Reference clock oscillator input. Typically connected to a 23-MHz to 26-MHz LVCMOS-level oscillator (100 ppm). For 400-Mbps, 800-Mbps or 1.6-Gbps CSI-2 data rates, use 25-MHz frequency. For the oscillator requirements, see Section 7.4.4. For other common CSI-2 data rates, see Section 7.4.19. |
| RES | 4 | - | This pin must be tied to GND for normal operation. |
| CMLOUTP | 56 | O | Channel Monitor Loop-through Driver differential output. Route to a test point or a pad with 100-Ω termination resistor between pins for channel monitoring (recommended). See Section 7.4.8. |
| CMLOUTN | 57 | ||
| NC | 34 - 43 | - | NO CONNECT pins. Leave these pins unconnected. |
The definitions below define the functionality of the I/O cells for each pin. TYPE:
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