ZHCSQD1 August   2022 DS320PR810

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Charateristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Jitter Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Linear Equalization
      2. 7.3.2 Flat-Gain
      3. 7.3.3 Receiver Detect State Machine
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active PCIe Mode
      2. 7.4.2 Active Buffer Mode
      3. 7.4.3 Standby Mode
    5. 7.5 Programming
      1. 7.5.1 Pin mode
        1. 7.5.1.1 Five-Level Control Inputs
      2. 7.5.2 SMBUS/I2C Register Control Interface
        1. 7.5.2.1 Shared Registers
        2. 7.5.2.2 Channel Registers
      3. 7.5.3 SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 PCIe Reach Extension – x16 Lane Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

6.4 Thermal Information

THERMAL METRIC(1) DS320PR810 UNIT
NJX, 64 Pins
RθJA-High K Junction-to-ambient thermal resistance 22.9 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 9.6 ℃/W
RθJB Junction-to-board thermal resistance 7.2 ℃/W
ψJT Junction-to-top characterization parameter 1.8 ℃/W
ψJB Junction-to-board characterization parameter 7.1 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 ℃/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.