ZHCSD85F August   2012  – November 2018 DS125BR800

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics: Serial Management Bus Interface
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 4-Level Input Configuration Guidelines
      2. 8.3.2 PCIe Signal Integrity
        1. 8.3.2.1 RX-Detect in SAS/SATA (up to 6 Gbps) Applications
          1. 8.3.2.1.1 Signal Detect Control for Datarates above 8 Gbps
        2. 8.3.2.2 MODE Operation with SMBus Registers
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBus Mode
    5. 8.5 Programming
      1. 8.5.1 SMBus Master Mode
      2. 8.5.2 Transfer of Data Via the SMBus
      3. 8.5.3 System Management Bus (SMBus) and Configuration Registers
      4. 8.5.4 SMBus Transactions
      5. 8.5.5 Writing a Register
      6. 8.5.6 Reading a Register
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V or 2.5-V Supply Mode Operation
    2. 10.2 Power Supply Bypassing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6 Electrical Characteristics: Serial Management Bus Interface

over recommended operating supply and temperature ranges unless other specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SERIAL BUS INTERFACE DC SPECIFICATIONS
VIL Data, Clock Input Low Voltage 0.8 V
VIH Data, Clock Input High Voltage 2.1 3.6 V
IPULLUP Current Through Pull-Up Resistor or Current Source High Power Specification 4 mA
VDD Nominal Bus Voltage 2.375 3.6 V
ILEAK-Bus Input Leakage Per Bus Segment (1)  –200 200 µA
ILEAK-Pin Input Leakage Per Device Pin –15 µA
CI Capacitance for SDA and SCL (1)(2) 10 pF
RTERM External Termination Resistance pull to VDD = 2.5 V ± 5% or 3.3 V ± 10% Pullup VDD = 3.3 V(1)(2)(3) 2000 Ω
Pullup VDD = 2.5 V(1)(2)(3) 1000 Ω
(1) Recommended value.
(2) Recommended maximum capacitance load per bus segment is 400 pF.
(3) Maximum termination voltage should be identical to the device supply voltage.