ZHCSEP5D January   2016  – November 2018 DRV8884

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      微步进电流波形
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Current Regulation
      5. 7.3.5  Controlling RREF With an MCU DAC
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Mode 1: Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 3: Mixed Decay for Increasing and Decreasing Current
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  LDO Voltage Regulator
      10. 7.3.10 Logic and Multi-Level Pin Diagrams
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM UVLO
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
        4. 7.3.11.4 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.7 Blanking Time

After the current is enabled in an H-bridge, the current sense comparator is ignored for a period of time (tBLANK) before enabling the current sense circuitry. Note that the blanking time also sets the minimum drive time of the PWM. Table 7 shows the blanking time based on the sine table index and the torque DAC setting. Note that the torque DAC index is not the same as one step as given in Table 3.

Table 7. Adaptive Blanking Time over Torque DAC and Microsteps

tblank = 1.5 µs tblank = 1.0 µs
SINE INDEX TORQUE DAC (TRQ)
100% 75% 50%
16 100% 75% 50%
15 98% 73.5 49%
14 96% 72% 48%
13 92% 69% 46%
12 88% 66% 44%
11 83% 62.3% 41.5%
10 77% 57.8% 38.5%
9 71% 53.3% 35.5%
8 63% 47.3% 31.5%
7 56% 42% 28%
6 47% 35.3 23.5%
5 38% 28.5 19%
4 29% 21.8% 14.5%
3 20% 15% 10%
2 10% 7.5% 5%
1 0% 0% 0%