ZHCSQT3K October   2009  – January 2022 DRV8824

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Current Regulation
      3. 7.3.3 Decay Mode
      4. 7.3.4 Blanking Time
      5. 7.3.5 Microstepping Indexer
      6. 7.3.6 nRESET, nENBL and nSLEEP Operation
      7. 7.3.7 Protection Circuits
        1. 7.3.7.1 Overcurrent Protection (OCP)
        2. 7.3.7.2 Thermal Shutdown (TSD)
        3. 7.3.7.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 STEP/DIR Interface
      2. 7.4.2 Microstepping
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
        1.       Power Supply Recommendations
          1. 9.1 Bulk Capacitance
          2. 9.2 Power Supply and Logic Sequencing
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
    4. 9.4 Power Dissipation
    5. 9.5 Heatsinking
  10. 10Device and Documentation Support
    1. 10.1 Community Resources
    2. 10.2 Trademarks
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RHD|28
  • PWP|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.4 Power Dissipation

Power dissipation in the DRV8824 is dominated by the power dissipated in the output FET resistance, or RDS(ON). Average power dissipation when running a stepper motor can be roughly estimated by Equation 5.

Equation 5. GUID-E1109946-DC32-46B3-A5F8-2AACED2F97E4-low.gif

where

  • PTOT is the total power dissipation
  • RDS(ON) is the resistance of each FET
  • IOUT(RMS) is the RMS output current being applied to each winding

IOUT(RMS) is equal to the approximately 0.7× the full-scale output current setting. The factor of 4 comes from the fact that there are two motor windings, and at any instant two FETs are conducting winding current for each winding (one high-side and one low-side).

The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking.

Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. This must be taken into consideration when sizing the heatsink.