ZHCS408C August   2011  – June 2015 DRV201

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Transmission Timing
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCM Driver Output Stage Operation
      2. 7.3.2 Ringing Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C Bus Operation
        1. 7.5.1.1 Single Write to a Defined Location
        2. 7.5.1.2 Single Read from a Defined Location and Current Location
        3. 7.5.1.3 Sequential Read and Write
      2. 7.5.2 I2C Device Address, Start and Stop Condition
    6. 7.6 Register Maps
      1. 7.6.1 Register Address Map
      2. 7.6.2 Control Register (Control) Address - 0x02h
      3. 7.6.3 VCM MSB Current Control Register (VCM_Current_MSB) Address - 0x03h
      4. 7.6.4 VCM LSB Current Control Register (VCM_Current_LSB) Address - 0x04h
      5. 7.6.5 Status Register (Status) Address - 0x05h
      6. 7.6.6 Mode Register (Mode) Address - 0x06h
      7. 7.6.7 VCM Resonance Frequency Register (VCM_FREQ) Address - 0x07h
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VCM Mechanical Ringing Frequency
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 User Example 1
        2. 8.2.2.2 User Example 2
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (November 2013) to C Revision

  • Added ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go

Changes from A Revision (June 2012) to B Revision

  • Changed minor datasheet errata in register maps. Updated to reflect correct bit valuesGo