ZHCSLL6B April   2021  – January 2023 DP83TC812R-Q1 , DP83TC812S-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Electrostatic Discharge Sensing
        3. 8.3.1.3 Time Domain Reflectometry
        4. 8.3.1.4 Voltage Sensing
        5. 8.3.1.5 BIST and Loopback Modes
          1. 8.3.1.5.1 Data Generator and Checker
          2. 8.3.1.5.2 xMII Loopback
          3. 8.3.1.5.3 PCS Loopback
          4. 8.3.1.5.4 Digital Loopback
          5. 8.3.1.5.5 Analog Loopback
          6. 8.3.1.5.6 Reverse Loopback
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep Ack
      6. 8.4.6  Sleep Request
      7. 8.4.7  Sleep Fail
      8. 8.4.8  Sleep
      9. 8.4.9  Wake-Up
      10. 8.4.10 TC10 System Example
      11. 8.4.11 Media Dependent Interface
        1. 8.4.11.1 100BASE-T1 Master and 100BASE-T1 Slave Configuration
        2. 8.4.11.2 Auto-Polarity Detection and Correction
        3. 8.4.11.3 Jabber Detection
        4. 8.4.11.4 Interleave Detection
      12. 8.4.12 MAC Interfaces
        1. 8.4.12.1 Media Independent Interface
        2. 8.4.12.2 Reduced Media Independent Interface
        3. 8.4.12.3 Reduced Gigabit Media Independent Interface
        4. 8.4.12.4 Serial Gigabit Media Independent Interface
      13. 8.4.13 Serial Management Interface
      14. 8.4.14 Direct Register Access
      15. 8.4.15 Extended Register Space Access
      16. 8.4.16 Write Address Operation
        1. 8.4.16.1 MMD1 - Write Address Operation
      17. 8.4.17 Read Address Operation
        1. 8.4.17.1 MMD1 - Read Address Operation
      18. 8.4.18 Write Operation (No Post Increment)
        1. 8.4.18.1 MMD1 - Write Operation (No Post Increment)
      19. 8.4.19 Read Operation (No Post Increment)
        1. 8.4.19.1 MMD1 - Read Operation (No Post Increment)
      20. 8.4.20 Write Operation (Post Increment)
        1. 8.4.20.1 MMD1 - Write Operation (Post Increment)
      21. 8.4.21 Read Operation (Post Increment)
        1. 8.4.21.1 MMD1 - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TC812 Registers
  9. 9 Application and Implementation
    1. 9.1 应用信息免责声明
    2. 9.2 Application Information
    3. 9.3 Typical Applications
      1. 9.3.1 Design Requirements
        1. 9.3.1.1 Physical Medium Attachment
          1. 9.3.1.1.1 Common-Mode Choke Recommendations
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Metal Pour
      4. 11.1.4 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 支持资源
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

4 Revision History

Changes from Revision A (December 2021) to Revision B (January 2023)

  • 向特性列表中添加了“提供功能安全型”Go
  • Table 6-1 Pin Functions: Changed TX_CLK description to include (50 ohm Driver) for MII transmit clock.Go
  • Table 6-4 Pin States -TC10 SLEEP: Changed the PULL TYPE of Pin 16 CLKOUT from PD->noneGo
  • Added line to CLKOUT/GPIO2's description about which registers to program to disable switchingGo
  • Added line to INT pin description. Reg 12-13 is recommended to be read only when INT_N is LOWGo
  • MDC clock rate changed from 25MHz->20MHz in Serial Management Interface Section of Pin Function TableGo
  • Updated Iozh to clarify mapping of Rx_Ctrl and Rx_ER pinsGo
  • Removed Supply ramp delay offset: For all suppliesGo
  • Power-Up Timing figure correctedGo
  • PHY Operation State Diagram figure updatedGo
  • Added Auto-clear note to register 0x18B[6]Go
  • Added XI clock PPM TableGo
  • Added Auto-clear note to register 0x18B[6]Go
  • Register 0x63E, clarified Bit DescriptionGo
  • Register 0x63D, clarified Bit DescriptionGo
  • Register 0x63C, clarified Bit DescriptionGo
  • Register 0x63B, clarified Bit DescriptionGo
  • Register 0x63A, clarified Bit DescriptionGo
  • Register 0x639, clarified Bit DescriptionGo
  • Register 0x451, clarified Bit Descriptions Go
  • Register 0x18B has been addedGo
  • Register 0x12, Bit 15 has been removedGo

Changes from Revision * (April 2021) to Revision A (December 2021)

  • 将“预告信息”更改为“量产数据发布”Go
  • 更新了“特性”列表Go
  • Added DP83TC812R-Q1 part to the datasheetGo
  • Updated Pin Function and Pin States tableGo
  • Added Pin Domain tableGo
  • Updated Electrical Characteristics tableGo
  • Updated Timing Requirement tableGo
  • Added Typical Characteristic sectionGo
  • Added Electrostatic Discharge Sensing SectionGo
  • Added BIST and Loopback Modes sectionGo
  • Added Media Dependent Interface sectionsGo
  • Added MAC Interfaces sectionGo
  • Updated PHY Address table in Strap Configuration sectionGo