ZHCSCU2E February   2014  – November 2020 DLPC3433 , DLPC3438

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Test Pins and General Control
    2. 5.2 Parallel Port Input
    3. 5.3 DSI Input Data and Clock
    4. 5.4 DMD Reset and Bias Control
    5. 5.5 DMD Sub-LVDS Interface
    6. 5.6 Peripheral Interface
    7. 5.7 GPIO Peripheral Interface
    8. 5.8 Clock and PLL Support
    9. 5.9 Power and Ground
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 BT656 Interface General Timing Requirements
    15. 6.15 DSI Host Timing Requirements
    16. 6.16 Flash Interface Timing Requirements
    17. 6.17 Other Timing Requirements
    18. 6.18 DMD Sub-LVDS Interface Switching Characteristics
    19. 6.19 DMD Parking Switching Characteristics
    20. 6.20 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 PDATA Bus – Parallel Interface Bit Mapping Modes
        4. 7.3.1.4 DSI Interface
      2. 7.3.2 Device Startup
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  PLL Power Layout
      2. 10.1.2  Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3  DSI Interface Layout
      4. 10.1.4  Unused Pins
      5. 10.1.5  DMD Control and Sub-LVDS Signals
      6. 10.1.6  Layer Changes
      7. 10.1.7  Stubs
      8. 10.1.8  Terminations
      9. 10.1.9  Routing Vias
      10. 10.1.10 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
      2. 11.2.2 Related Links
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

5.2 Parallel Port Input

PIN(1)(2)I/OTYPE(4)DESCRIPTION
NAMENO.PARALLEL RGB MODEBT656 INTERFACE MODE
PCLKP3I11Pixel clockPixel clock
PDM_CVS_TEN4I/O5Parallel data mask. Programable polarity with default of active high. Optional signal.Unused
VSYNC_WEP1I11Vsync(3)Unused
HSYNC_CSN5I11Hsync(3)Unused
DATAEN_CMDP2I11Data validUnused
(TYPICAL RGB 888)
PDATA_0
PDATA_1
PDATA_2
PDATA_3
PDATA_4
PDATA_5
PDATA_6
PDATA_7		K2
K1
L2
L1
M2
M1
N2
N1		I11Blue (bit weight 1)
Blue (bit weight 2)
Blue (bit weight 4)
Blue (bit weight 8)
Blue (bit weight 16)
Blue (bit weight 32)
Blue (bit weight 64)
Blue (bit weight 128)		BT656_Data (0)
BT656_Data (1)
BT656_Data (2)
BT656_Data (3)
BT656_Data (4)
BT656_Data (5)
BT656_Data (6)
BT656_Data (7)
(TYPICAL RGB 888)
PDATA_8
PDATA_9
PDATA_10
PDATA_11
PDATA_12
PDATA_13
PDATA_14
PDATA_15		R1
R2
R3
P4
R4
P5
R5
P6		I11Green (bit weight 1)
Green (bit weight 2)
Green (bit weight 4)
Green (bit weight 8)
Green (bit weight 16)
Green (bit weight 32)
Green (bit weight 64)
Green (bit weight 128)		Unused
(TYPICAL RGB 888)
PDATA_16
PDATA_17
PDATA_18
PDATA_19
PDATA_20
PDATA_21
PDATA_22
PDATA_23		R6
P7
R7
P8
R8
P9
R9
P10		I11Red (bit weight 1)
Red (bit weight 2)
Red (bit weight 4)
Red (bit weight 8)
Red (bit weight 16)
Red (bit weight 32)
Red (bit weight 64)
Red (bit weight 128)		Unused
3DRN6I113D reference
  • For 3D applications: left or right 3D reference (left = 1, right = 0). To be provided by the host. Must transition in the middle of each frame (no closer than 1 ms to the active edge of VSYNC).
  • If a 3D application is not used, pull this input low through an external resistor.
(1) PDATA(23:0) bus mapping depends on pixel format and source mode. See later sections for details.
(2) Connect unused inputs to ground or pulldown to ground through an external resistor (8 kΩ or less).
(3) VSYNC and HSYNC polarity can be adjusted by software.
(4) See Table 5-2 for type definitions.