ZHCSRS7A August   2017  – February 2023 DLP650NE

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On or Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On or Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
        1.       Application and Implementation
          1. 8.1 Application Information
          2. 8.2 Typical Application
            1. 8.2.1 Design Requirements
            2. 8.2.2 Detailed Design Procedure
  8. 8 Power Supply Requirements
    1. 8.1 DMD Power Supply Requirements
    2. 8.2 DMD Power Supply Power-Up Procedure
    3. 8.3 DMD Power Supply Power-Down Procedure
  9. 9 Device Documentation Support
    1. 9.1 第三方产品免责声明
    2. 9.2 Device Support
      1. 9.2.1 Device Nomenclature
      2. 9.2.2 Device Markings
    3. 9.3 Documentation Support
      1. 9.3.1 Related Documentation
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 支持资源
    6. 9.6 Trademarks
    7. 9.7 静电放电警告
    8. 9.8 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • FYE|350
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.10 Micromirror Array Physical Characteristics

VALUEUNIT
Number of active columns(1)M1920micromirrors
Number of active rows(1)N1080micromirrors
Micromirror (pixel) pitch(1)P7.56µm
Micromirror active array width(1)Micromirror Pitch × number of active columns14.5152mm
Micromirror active array height(1)Micromirror Pitch × number of active rows8.1648mm
Micromirror active border(2)Pond of micromirrors (POM)14micromirrors /side
(1) See Figure 6-11.
(2) The structure and qualities of the border around the active array includes a band of partially functional micromirrors referred to as the pond of micromirrors (POM). These micromirrors are structurally and/or electrically prevented from tilting toward the bright or ON state, but still require an electrical bias to tilt toward OFF.
GUID-38B6DF7C-B5B8-4182-B2CF-E32420E6E6AC-low.gif
Refer to Micromirror Array Physical Characteristics for M, N, and P specifications.
Figure 6-11 Micromirror Array Physical Characteristics