ZHCSRS7A August   2017  – February 2023 DLP650NE

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On or Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On or Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
        1.       Application and Implementation
          1. 8.1 Application Information
          2. 8.2 Typical Application
            1. 8.2.1 Design Requirements
            2. 8.2.2 Detailed Design Procedure
  8. Power Supply Requirements
    1. 8.1 DMD Power Supply Requirements
    2. 8.2 DMD Power Supply Power-Up Procedure
    3. 8.3 DMD Power Supply Power-Down Procedure
  9. Device Documentation Support
    1. 9.1 第三方产品免责声明
    2. 9.2 Device Support
      1. 9.2.1 Device Nomenclature
      2. 9.2.2 Device Markings
    3. 9.3 Documentation Support
      1. 9.3.1 Related Documentation
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 支持资源
    6. 9.6 Trademarks
    7. 9.7 静电放电警告
    8. 9.8 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • FYE|350
散热焊盘机械数据 (封装 | 引脚)
订购信息

Timing Requirements

Over Recommended Operating Conditions (Section 6.4) unless otherwise noted.(5)
DESCRIPTION(1)MINTYPMAXUNIT
SCP INTERFACE(2)
trRise time20% to 80% reference points200ns
tƒFall time80% to 20% reference points200ns
LVDS INTERFACE(2)
trRise time20% to 80%100400ps
tƒFall time80% to 20%100400ps
LVDS CLOCKS(3)
tcCycle timeDCLK_A, 50% to 50%2.5ns
DCLK_B, 50% to 50%2.5
twPulse durationDCLK_A, 50% to 50%1.191.25ns
DCLK_B, 50% to 50%1.191.25
LVDS INTERFACE(3)
tsuSetup timeD_A(15:0) before rising or falling edge of DCLK_A0.1ns
D_B(15:0) before rising or falling edge of DCLK_B0.1
tsuSetup timeSCTRL_A before rising or falling edge of DCLK_A0.1ns
SCTRL_B before rising or falling edge of DCLK_B0.1
thHold timeD_A(15:0) after rising or falling edge of DCLK_A0.4ns
D_B(15:0) after rising or falling edge of DCLK_B0.4
thHold timeSCTRL_A after rising or falling edge of DCLK_A0.3ns
SCTRL_B after rising or falling edge of DCLK_B0.3
LVDS INTERFACE(4)
tskewSkew timeChannel B relative to Channel A(4)Channel A includes the following LVDS pairs:
DCLK_AP and DCLK_AN
SCTRL_AP and SCTRL_AN
D_AP(15:0) and D_AN(15:0)
–1.251.25ns
Channel B includes the following LVDS pairs:
DCLK_BP and DCLK_BN
SCTRL_BP and SCTRL_BN
D_BP(15:0) and D_BN(15:0)
Refer to Section 5 for pin details.
Refer to Figure 6-6.
Refer to Figure 6-8.
Refer to Figure 6-9.
Tested at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be considered.
GUID-50E87C35-09D7-4F93-8F4A-638B5BFC5A17-low.gif
Not to scale
Refer to the SCP Interface section of the Recommended Operating Conditions Section 6.4.
Figure 6-2 SCP Timing Parameters
GUID-12C8A3A2-F1A5-4CCB-93D1-D95FA4135EE7-low.gif
Refer to the LVDS Interface section of the Recommended Operating Conditions (Section 6.4).
Refer to the Pin Functions table for the list of LVDS pins.
Figure 6-3 LVDS Voltage Definitions (References)
GUID-9E737327-3F73-480E-990F-450B7927B96B-low.gif
Not to scale
Refer to the LVDS Interface section of the Recommended Operating Conditions (Section 6.4).
Figure 6-4 LVDS Voltage Parameters
GUID-4279F3CE-8DE7-42AA-8919-F5F4B35BD8AA-low.gif
Refer to the LVDS Interface section of the Recommended Operating Conditions (Section 6.4).
Refer to the Pin Functions table for the list of LVDS pins.
Figure 6-5 LVDS Equivalent Input Circuit
GUID-6CF52A74-AEAF-40BA-A368-897BB93BDC46-low.gif
Not to scale
Refer to the timing requirements.
Refer to the Pin Functions table for the list of LVDS pins and SCP pins.
Figure 6-6 Rise Time and Fall Time
GUID-9CD0F9DB-AEF2-41C4-A294-6615724830F3-low.gifFigure 6-7 Test Load Circuit for Output Propagation Measurement

For output timing analysis, the tester pin electronics and its transmission line effects must be considered. System design should use IBIS or other simulation tools to correlate the timing reference load to a system environment. See Figure 6-7.

GUID-12CDCE2F-7AD3-4112-B404-4ECB9CD0B0C7-low.gif
Not to scale
Refer to the LVDS Interface section in the timing requirements.
Figure 6-8 Timing Requirement Parameter Definitions
GUID-10909C33-0434-46A7-9A5D-95994B76F72E-low.gif
Not to scale
Refer to the LVDS Interface section in the timing requirements.
Figure 6-9 LVDS Interface Channel Skew Definition