ZHCSRS7A August   2017  – February 2023 DLP650NE

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On or Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On or Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
        1.       Application and Implementation
          1. 8.1 Application Information
          2. 8.2 Typical Application
            1. 8.2.1 Design Requirements
            2. 8.2.2 Detailed Design Procedure
  8. 8 Power Supply Requirements
    1. 8.1 DMD Power Supply Requirements
    2. 8.2 DMD Power Supply Power-Up Procedure
    3. 8.3 DMD Power Supply Power-Down Procedure
  9. 9 Device Documentation Support
    1. 9.1 第三方产品免责声明
    2. 9.2 Device Support
      1. 9.2.1 Device Nomenclature
      2. 9.2.2 Device Markings
    3. 9.3 Documentation Support
      1. 9.3.1 Related Documentation
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 支持资源
    6. 9.6 Trademarks
    7. 9.7 静电放电警告
    8. 9.8 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • FYE|350
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision * (August 2017) to Revision A (February 2023)

  • 根据最新的德州仪器 (TI) 和行业数据表标准对本文档进行了更新。将控制器更新为 DLPC4430。更新了芯片组元件的链接Go
  • 将控制器更新为 DLPC4430Go
  • Added typical values to IOFFSET, IBIAS, and IRESET currents. Removed DLPA4000, not supported.Go
  • Updated controller to DLPC4430Go
  • Changed device supported modes for technical accuracy.Go
  • Updated DMD Thermal Test Points illustrationGo
  • Updated controller to DLPC4430Go
  • Removed DLPA4000, not supported as PMIC. Added a table with additional legacy device information and referenced the mechanical ICDGo
  • Updated controller to DLPC4430Go
  • Updated Typical DLPC4430 Application schematicGo
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430Go
  • Updated the controller to DLPC4430 and the related documentationGo