ZHCSKV7A November   2020  – July 2022 DLP500YX

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Capacitance at Recommended Operating Conditions
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics
    10. 6.10 System Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Window Characteristics
    14. 6.14 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Micromirror Array Temperature Calculation using Illumination Power Density
      2. 7.6.2 Micromirror Array Temperature Calculation using Total Illumination Power
      3. 7.6.3 Micromirror Array Temperature Calculation using Screen Lumens
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 DMD Die Temperature Sensing
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
    3. 9.3 Restrictions on Hot Plugging and Hot Swapping
      1. 9.3.1 No Hot Plugging
      2. 9.3.2 No Hot Swapping
      3. 9.3.3 Intermittent or Voltage Power Spike Avoidance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Critical Signal Guidelines
      2. 10.1.2 Power Connection Guidelines
      3. 10.1.3 Noise Coupling Avoidance
    2. 10.2 Layout Example
      1. 10.2.1 Layers
      2. 10.2.2 Impedance Requirements
      3. 10.2.3 Trace Width, Spacing
        1. 10.2.3.1 Voltage Signals
  11. 11Device and Documentation Support
    1. 11.1 第三方产品免责声明
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 接收文档更新通知
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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7.5.1 Numerical Aperture and Stray Light Control

The angle defined by the numerical aperture of the illumination and projection optics at the DMD optical area needs to be the same. This angle cannot exceed the nominal device micromirror tilt angle unless appropriate apertures are added in the illumination and/or projection pupils to block out flat-state and stray light from the projection lens. The micromirror tilt angle defines DMD capability to separate the "ON" optical path from any other light path, including undesirable flat-state specular reflections from the DMD window, DMD border structures, or other system surfaces near the DMD such as prism or lens surfaces. If the numerical aperture exceeds the micromirror tilt angle, or if the projection numerical aperture angle is more than two degrees larger than the illumination numerical aperture angle (and vice versa), contrast degradation, and objectionable artifacts in the display border and/or active area could occur.