ZHCSII4F july   2018  – july 2023 DLP230NP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 显示应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Power-Up Procedure
      2. 8.3.2 Power Supply Power-Down Procedure
      3. 8.3.3 Power Supply Sequencing Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
      2. 9.1.2 Device Nomenclature
      3. 9.1.3 Device Markings
    2. 9.2 Chipset Resources
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

DLP230NP 和 DLP230NPSE .23 1080p 数字微镜器件 (DMD) 是数控微光机电系统 (MOEMS) 空间照明调制器 (SLM)。当与适当的光学系统搭配使用时，这些 DMD 可显示清晰和高质量的1080p图像或视频。全亮度芯片组包括 DLP230NP DMD 和 DLPC3436 控制器。亮度较低的芯片组包括 DLP230NPSE DMD 和 DLPC3436 控制器。DLPA3000 和 DLPA3005 PMIC/LED 驱动器支持这两种芯片组，而 DLPA2000 和 DLPA2005 仅支持全亮度选项。 此器件外形小巧，适用于重视高画质、小尺寸和低功耗的便携设备。

器件信息
器件型号 封装(1) 封装尺寸（标称值）
DLP230NP FQP (54) 16.8mm × 5.92mm × 3.58mm
DLP230NPSE
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
GUID-20211029-SS0I-XVJP-ZG1K-FG0WLRS91NGM-low.svg简化版应用