ZHCSII4G July   2018  – October 2024 DLP230NP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 显示应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements
    8. 5.8  Switching Characteristics
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  10. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 Device Nomenclature
      3. 10.1.3 Device Markings
    2. 10.2 Chipset Resources
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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6.1 Overview

The DLP230NP and DLP230NPSE devices are 0.23-inch diagonal spatial light modulators of aluminum micromirrors. The micromirror array size is 960 columns by 540 rows in a square micromirror arrangement. The fast switching speed of the DMD micromirrors, combined with advanced DLP image processing algorithms, enables each micromirror to display 四 distinct pixels on the screen during every frame, resulting in a full 1920 × 1080 pixel image display. The electrical interface is sub-low voltage differential signaling (SubLVDS) data.

For the DLP230NP device, the DLPA2000, DLPA2005, DLPA3000, and DLPA3005 PMIC/LED drivers support this chipset. Currently, only the DLPA3000 driver supports the DLP230NPSE DMD. To ensure reliable operation, the DLP230NP/NPSE DMD must always be used with the DLPC34x6 ZVB display controller and the DLPA2000, DLPA2005, DLPA3000, or DLPA3005 PMIC/LED driver.