ZHCSII4G July   2018  – October 2024 DLP230NP

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 显示应用
4. 3 说明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  Storage Conditions
   3. 5.3  ESD Ratings
   4. 5.4  Recommended Operating Conditions
   5. 5.5  Thermal Information
   6. 5.6  Electrical Characteristics
   7. 5.7  Timing Requirements
   8. 5.8  Switching Characteristics
   9. 5.9  System Mounting Interface Loads
   10. 5.10 Micromirror Array Physical Characteristics
   11. 5.11 Micromirror Array Optical Characteristics
   12. 5.12 Window Characteristics
   13. 5.13 Chipset Component Usage Specification
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
   4. 6.4 Device Functional Modes
   5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
   6. 6.6 Micromirror Array Temperature Calculation
   7. 6.7 Micromirror Power Density Calculation
   8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
9. 8 Layout
   1. 8.1 Layout Guidelines
   2. 8.2 Layout Example
10. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
11. 10Device and Documentation Support
    1. 10.1 Device Support
       1. 10.1.1 第三方产品免责声明
       2. 10.1.2 Device Nomenclature
       3. 10.1.3 Device Markings
    2. 10.2 Chipset Resources
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information