SLLS853F August   2007  – January 2015 DAC5682Z

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics — DC Specification
    6. 7.6 Electrical Characteristics — AC Specification
    7. 7.7 Electrical Characteristics (Digital Specifications)
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  FIR Filters
      2. 8.3.2  Coarse Mixers: CMIX0 and CMIX1
      3. 8.3.3  Clock Inputs
      4. 8.3.4  LVDS Data Interfacing
      5. 8.3.5  LVDS Inputs
      6. 8.3.6  LVDS SYNCP/N Operation
      7. 8.3.7  DLL Operation
      8. 8.3.8  CMOS Digital Inputs
      9. 8.3.9  Reference Operation
      10. 8.3.10 DAC Transfer Function
      11. 8.3.11 DAC Output SINC Response
      12. 8.3.12 Analog Current Outputs
      13. 8.3.13 Designing the PLL Loop Filter
      14. 8.3.14 Test Methodology
    4. 8.4 Device Functional Modes
      1. 8.4.1 Dual-Channel Real Upconversion
      2. 8.4.2 Clock and Data Modes
      3. 8.4.3 PLL Clock Mode
      4. 8.4.4 Recommended Multi-DAC Synchronization Procedure Multi-DAC Synchronization Procedure
      5. 8.4.5 Digital Self Test Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1  Register Name: STATUS0 - Address: 0x00, Default = 0x03
      2. 8.6.2  Register Name: CONFIG1 - Address: 0x01, Default = 0x10
      3. 8.6.3  Register Name: CONFIG2 - Address: 0x02, Default = 0xC0
      4. 8.6.4  Register Name: CONFIG3 - Address: 0x03, Default = 0x70
      5. 8.6.5  Register Name: STATUS4 - Address: 0x04, Default = 0x00
      6. 8.6.6  Register Name: CONFIG5 - Address: 0x05, Default = 0x00
      7. 8.6.7  Register Name: CONFIG6 - Address: 0x06, Default = 0x0C
      8. 8.6.8  Register Name: CONFIG7 - Address: 0x07, Default = 0xFF
      9. 8.6.9  Register Name: CONFIG8 - Address: 0x08, Default = 0x00
      10. 8.6.10 Register Name: CONFIG9 - Address: 0x09, Default = 0x00
      11. 8.6.11 Register Name: CONFIG10 - Address: 0x0A, Default = 0x00
      12. 8.6.12 Register Name: CONFIG11 - Address: 0x0B, Default = 0x00
      13. 8.6.13 Register Name: CONFIG12 - Address: 0x0C, Default = 0x00
      14. 8.6.14 Register Name: CONFIG13 - Address: 0x0D, Default = 0x00
      15. 8.6.15 Register Name: CONFIG14 - Address: 0x0E, Default = 0x00
      16. 8.6.16 Register Name: CONFIG15 - Address: 0x0F, Default = 0x00
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Digital Interface and Clocking Considerations for Application Examples
      2. 9.3.2 Single Complex Input, Real IF Output Radio
      3. 9.3.3 Dual Channel Real IF Output Radio
      4. 9.3.4 Direct Conversion Radio
      5. 9.3.5 CMTS/VOD Transmitter
      6. 9.3.6 High-Speed Arbitrary Waveform Generator
    4. 9.4 Initialization Set Up
      1. 9.4.1 Recommended Start-up Sequence
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGC|64
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

The DAC5682Z EVM layout should be used as a reference for the layout to obtain the best performance. A sample layout is shown in Figure 53. Some important layout recommendations are:

  1. Use a single ground plane. Keep the digital and analog signals on distinct separate sections of the board. This may be virtually divided down the middle of the device package when doing placement and layout.
  2. Keep the analog outputs as far away from the switching clocks and digital signals as possible. This will keep coupling from the digital circuits to the analog outputs to a minimum.
  3. Decoupling caps should be kept close to the power pins of the device.

11.2 Layout Example

Top_DAC5682zEVM.pngFigure 53. Top Layer of DAC5682zEVM Layout