ZHCSBA2G April   2013  – January 2022 CSD17381F4

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 支持资源
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 术语表
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YJC|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision F (October 2021) to Revision G (January 2022)

  • 特性 中的高度尺寸从“0.35mm”更改为“0.36mm”Go
  • 典型尺寸 中的高度尺寸从“0.35mm”更改为“0.36mm” Go
  • Changed height dimension from "0.35 mm" to "0.36 mm" in Mechanical Dimensions Go

Changes from Revision E (December 2017) to Revision F (October 2021)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • Changed footnote to refer to correct support documentGo

Changes from Revision D (August 2014) to Revision E (December 2017)

  • 将脉冲漏极电流值从 10A 更改为 12A(位于绝对最大额定值 表格中)Go
  • 将注释 2 从“脉冲持续时间 ≤ 300μs,占空比 ≤ 2%”更改为“脉冲持续时间 ≤ 100μs,占空比 ≤ 1%”Go
  • Updated Figure 5-1. Go
  • Updated Figure 5-10 with newly measured data. Go
  • Updated all mechanical drawings, increased the size of the pads in Section 7.3 Go