SLPS224C August   2009  – November 2016 CSD16323Q3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQG|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (June 2011) to C Revision

  • Changed Description textGo
  • Added silicon limited continuous drain current to Absolute Maximum Ratings tableGo
  • Changed Note 2 in Absolute Maximum Ratings tableGo
  • Changed values in the Thermal Information table to align with standardsGo
  • Changed Figure 1 to reflect a transient RθJC curveGo
  • Changed Figure 10 to reflect measured dataGo
  • Added Device and Documentation Support sectionGo
  • Changed MECHANICAL DATA section to Mechanical, Packaging, and Orderable Information sectionGo

Changes from A Revision (April 2010) to B Revision

  • Replaced the THERMAL CHARACTERISTICS table with the new Thermal Information TableGo
  • Replaced Figure 10 - Maximum Safe Operating AreaGo

Changes from * Revision (August 2009) to A Revision

  • Changed RDS(on) - VGS = 3 V, ID = 24 A MAX value From: 6.5 To: 7.2Go