ZHCSFM3B
October 2016 – February 2022
CSD13385F5
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Specifications
5.1
Electrical Characteristics
5.2
Thermal Information
5.3
Typical MOSFET Characteristics
6
Device and Documentation Support
6.1
Receiving Notification of Documentation Updates
6.2
Trademarks
7
Mechanical, Packaging, and Orderable Information
7.1
Mechanical Dimensions
7.2
Recommended Minimum PCB Layout
7.3
Recommended Stencil Pattern
封装选项
机械数据 (封装 | 引脚)
YJK|3
MXLG029B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsfm3b_oa
zhcsfm3b_pm
5.2
Thermal Information
T
A
= 25°C (unless otherwise stated)
THERMAL METRIC
MIN
TYP
MAX
UNIT
R
θJA
Junction-to-ambient thermal resistance
(1)
90
°C/W
Junction-to-ambient thermal resistance
(2)
245
(1)
Device mounted on FR4 material with 1-in
2
(6.45-cm
2
), 2-oz (0.071-mm) thick Cu.
(2)
Device mounted on FR4 material with minimum Cu mounting area.