ZHCSTF3H June   2007  – February 2024 CDCE913 , CDCEL913

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EEPROM Specification
    7. 5.7 Timing Requirements: CLK_IN
    8. 5.8 Timing Requirements: SDA/SCL
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Configuration
      2. 7.3.2 Default Device Configuration
      3. 7.3.3 SDA/SCL Serial Interface
      4. 7.3.4 Data Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA/SCL Hardware Interface
    5. 7.5 Programming
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Spread-Spectrum Clock (SSC)
        2. 8.2.2.2 PLL Frequency Planning
        3. 8.2.2.3 Crystal Oscillator Start-up
        4. 8.2.2.4 Frequency Adjustment with Crystal Oscillator Pulling
        5. 8.2.2.5 Unused Inputs/Outputs
        6. 8.2.2.6 Switching Between XO and VCXO Mode
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Register Maps
    1. 9.1 SDA/SCL Configuration Registers
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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5.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1)(2)(3) CDCEx913 UNIT
PW [TSSOP]
14 PINS
RθJA Junction-to-ambient thermal resistance Airflow 0 lfm 106 °C/W
Airflow 150 lfm 93
Airflow 200 lfm 92
Airflow 250 lfm 90
Airflow 500 lfm 85
RθJC(top) Junction-to-case (top) thermal resistance 1.4 °C/W
RθJB Junction-to-board thermal resistance 66 °C/W
ψJT Junction-to-top characterization parameter 1.35 °C/W
ψJB Junction-to-board characterization parameter 61.83 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 62 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-K board).
(3) For the most-current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.