ZHCSJJ0C August   2000  – March 2024 BUF634

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
    6. 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
    7. 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
    8. 6.8 Typical Characteristics: TO-220 and TO-263 Packages
    9. 6.9 Typical Characteristics: SOIC Package
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 High Frequency Applications
    2. 8.2 Typical Application
      1. 8.2.1 Boosting Op Amp Output Current
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ 仿真软件（免费下载）
        2. 9.1.1.2 TI 参考设计
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision B (March 2019) to Revision C (March 2024)

  • 删除了数据表中的 PDIP 封装Go
  • 从数据表中删除了 DDPAK 名称的大多数实例并替换为 TO-263Go
  • 删除了比较 BUF634 和 BUF634A 的段落Go
  • Removed PDIP packageGo
  • Changed BUF634F to BUF634U for SOIC and PDIP packages in ESD Ratings Go
  • Changed values for D (SOIC) package in Thermal Information tableGo
  • Added Electrical Characteristics table specifically for TO‑220 and TO‑263 packagesGo
  • Added Typical Characteristics section specifically for TO-220 and TO-263 packagesGo
  • Added new block diagram for SOIC packagesGo

Changes from Revision A (November 2015) to Revision B (March 2019)

  • 向特性 和说明 部分添加了关于 BUF634A 升级器件的讨论Go
  • 将放大器更改为 OPA2810 并从提升任何运算放大器的输出电流 图中删除了表格Go
  • Added Device Comparison Table Go

Changes from Revision * (September 2000) to Revision A (April 2015)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go