ZHCSJJ0C
August 2000 – March 2024
BUF634
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: TO-220 and TO-263 Packages
6.6
Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
6.7
Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
6.8
Typical Characteristics: TO-220 and TO-263 Packages
6.9
Typical Characteristics: SOIC Package
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Output Current
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
High Frequency Applications
8.2
Typical Application
8.2.1
Boosting Op Amp Output Current
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Power Dissipation
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.1.1.1
TINA-TI™ 仿真软件(免费下载)
9.1.1.2
TI 参考设计
9.2
Documentation Support
9.2.1
Related Documentation
9.3
接收文档更新通知
9.4
支持资源
9.5
Trademarks
9.6
静电放电警告
9.7
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
KC|5
MSOT008D
KTT|5
MPSF007E
散热焊盘机械数据 (封装 | 引脚)
KTT|5
PPTD069B
订购信息
zhcsjj0c_oa
zhcsjj0c_pm
7.2
Functional Block Diagram
Figure 7-1
Internal Block Diagram: TO-220 and TO-263
Figure 7-2
Internal Block Diagram: SOIC