ZHCS348C August   2011  – August 2018 BUF20800-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 General-call Reset and Power-up
      2. 7.3.2 Output Voltage
      3. 7.3.3 Output Latch
      4. 7.3.4 Programmable VCOM
      5. 7.3.5 REFH and REFL Input range
    4. 7.4 Device Functional Modes
      1. 7.4.1 Replacement of Traditional Gamma Buffer
      2. 7.4.2 Dynamic Gamma Control
    5. 7.5 Programming
      1. 7.5.1 Two-wire Bus Overview
      2. 7.5.2 Data Rates
      3. 7.5.3 Read/Write Operations
        1. 7.5.3.1 Writing
        2. 7.5.3.2 Reading
      4. 7.5.4 Register Maps
        1. 7.5.4.1 Addressing the BUF20800-Q1
      5. 7.5.5 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor Selection
        2. 8.2.2.2 REFH and REFL Voltage Settings
      3. 8.2.3 Application Curves
      4. 8.2.4 Configuration for 20 Gamma Channels
      5. 8.2.5 Configuration for 22 Gamma Channels
      6. 8.2.6 The BUF20800-Q1 in Industrial Applications
      7. 8.2.7 Total TI Panel Solution
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General PowerPAD Design Considerations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1) BUF20800-Q1 UNIT
DCP Package (HTSSOP Family)
38 PINS
RθJA Junction-to-ambient thermal resistance 28.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.4 °C/W
RθJB Junction-to-board thermal resistance 7.6 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 7.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 °C/W
1. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.