ZHCSTD7A December   2021  – November 2023 BQ79631-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Measurement System
        1. 8.3.1.1 Voltage Measurement System
          1. 8.3.1.1.1 Main ADC
            1. 8.3.1.1.1.1 VS Voltage Measurements
              1. 8.3.1.1.1.1.1 Analog Front End
              2. 8.3.1.1.1.1.2 VS Channel Measurements
              3. 8.3.1.1.1.1.3 Post-ADC Digital LPF
              4. 8.3.1.1.1.1.4 SRP and SRN Measurements
            2. 8.3.1.1.1.2 Temperature Measurements
              1. 8.3.1.1.1.2.1 DieTemp1 Measurement
              2. 8.3.1.1.1.2.2 GPIOs and TSREF Measurements
            3. 8.3.1.1.1.3 Main ADC Operation Control
              1. 8.3.1.1.1.3.1 Operation Modes and Status
          2. 8.3.1.1.2 AUX ADC
            1. 8.3.1.1.2.1 AUX Voltage Measurements
              1. 8.3.1.1.2.1.1 AUX Analog Front End
              2. 8.3.1.1.2.1.2 AUX Channel Measurements
            2. 8.3.1.1.2.2 AUX Temperature Measurements
              1. 8.3.1.1.2.2.1 DieTemp2 Measurement
              2. 8.3.1.1.2.2.2 AUX GPIO Measurements
            3. 8.3.1.1.2.3 MISC Measurements
            4. 8.3.1.1.2.4 AUX ADC Operation Control
          3. 8.3.1.1.3 Synchronization Between MAIN and AUX ADC Measurements
        2. 8.3.1.2 Current Sense ADC
      2. 8.3.2 OVUV Detection
        1. 8.3.2.1 OVUV Operation Modes
        2. 8.3.2.2 OVUV Control and Status
          1. 8.3.2.2.1 OVUV Control
          2. 8.3.2.2.2 OVUV Status
      3. 8.3.3 Power Supplies
        1. 8.3.3.1 AVAO_REF and AVDD_REF
        2. 8.3.3.2 LDOIN
        3. 8.3.3.3 AVDD
        4. 8.3.3.4 DVDD
        5. 8.3.3.5 CVDD and NEG5V
        6. 8.3.3.6 TSREF
      4. 8.3.4 GPIO Configuration
      5. 8.3.5 Communication, OTP, Diagnostic Control
        1. 8.3.5.1 Communication
          1. 8.3.5.1.1 Serial Interface
            1. 8.3.5.1.1.1 UART Physical Layer
              1. 8.3.5.1.1.1.1 UART Transmitter
              2. 8.3.5.1.1.1.2 UART Receiver
              3. 8.3.5.1.1.1.3 COMM CLEAR
            2. 8.3.5.1.1.2 Command and Response Protocol
              1. 8.3.5.1.1.2.1 Transaction Frame Structure
                1. 8.3.5.1.1.2.1.1 Frame Initialization Byte
                2. 8.3.5.1.1.2.1.2 Device Address Byte
                3. 8.3.5.1.1.2.1.3 Register Address Bytes
                4. 8.3.5.1.1.2.1.4 Data Bytes
                5. 8.3.5.1.1.2.1.5 CRC Bytes
                6. 8.3.5.1.1.2.1.6 Calculating Frame CRC Value
                7. 8.3.5.1.1.2.1.7 Verifying Frame CRC
              2. 8.3.5.1.1.2.2 Transaction Frame Examples
                1. 8.3.5.1.1.2.2.1 Single Device Read/Write
                2. 8.3.5.1.1.2.2.2 Stack Read/Write
                3. 8.3.5.1.1.2.2.3 Broadcast Read/Write
                4. 8.3.5.1.1.2.2.4 Broadcast Write Reverse Direction
          2. 8.3.5.1.2 Daisy-Chain Interface
            1. 8.3.5.1.2.1 Daisy-Chain Transmitter and Receiver Functionality
            2. 8.3.5.1.2.2 Daisy-Chain Protocol
          3. 8.3.5.1.3 Start Communication
            1. 8.3.5.1.3.1 Identify Base and Stack
            2. 8.3.5.1.3.2 Auto-Addressing
              1. 8.3.5.1.3.2.1 Setting Up the Device Addresses
              2. 8.3.5.1.3.2.2 Setting Up COMM_CTRL[STACK_DEV] and [TOP_STACK]
              3. 8.3.5.1.3.2.3 Storing Device Address to OTP
            3. 8.3.5.1.3.3 Synchronize Daisy-Chain DLL
            4. 8.3.5.1.3.4 Ring Communication
          4. 8.3.5.1.4 Communication Timeout
            1. 8.3.5.1.4.1 Short Communication Timeout
            2. 8.3.5.1.4.2 Long Communication Timeout
          5. 8.3.5.1.5 Communication Debug Mode
          6. 8.3.5.1.6 Multidrop Configuration
          7. 8.3.5.1.7 SPI Master
          8. 8.3.5.1.8 SPI Loopback
        2. 8.3.5.2 Fault Handling
          1. 8.3.5.2.1 Fault Status Hierarchy
            1. 8.3.5.2.1.1 Debug Registers
          2. 8.3.5.2.2 Fault Masking and Reset
            1. 8.3.5.2.2.1 Fault Masking
            2. 8.3.5.2.2.2 Fault Reset
          3. 8.3.5.2.3 Fault Signaling
            1. 8.3.5.2.3.1 Fault Status Transmitting in ACTIVE Mode
            2. 8.3.5.2.3.2 Fault Status Transmitting in SLEEP Mode
            3. 8.3.5.2.3.3 Heartbeat and Fault Tone
        3. 8.3.5.3 Nonvolatile Memory
          1. 8.3.5.3.1 OTP Page Status
          2. 8.3.5.3.2 OTP Programming
        4. 8.3.5.4 Diagnostic Control/Status
          1. 8.3.5.4.1 Power Supplies Check
            1. 8.3.5.4.1.1 Power Supply Diagnostic Check
            2. 8.3.5.4.1.2 Power Supply BIST
          2. 8.3.5.4.2 Thermal Shutdown and Warning Check
            1. 8.3.5.4.2.1 Thermal Shutdown
            2. 8.3.5.4.2.2 Thermal Warning
          3. 8.3.5.4.3 Oscillators Watchdog
          4. 8.3.5.4.4 OTP Error Check
            1. 8.3.5.4.4.1 OTP CRC Test and Faults
            2. 8.3.5.4.4.2 OTP Margin Read
            3. 8.3.5.4.4.3 Error Check and Correct (ECC) OTP
          5. 8.3.5.4.5 OVUV Detection Check
            1. 8.3.5.4.5.1 Parity Check
            2. 8.3.5.4.5.2 OVUV DAC Check
            3. 8.3.5.4.5.3 OVUV Protector BIST
          6. 8.3.5.4.6 Diagnostic Through ADC Comparison
            1. 8.3.5.4.6.1 VS Voltage Measurement Check
            2. 8.3.5.4.6.2 Temperature Measurement Check
            3. 8.3.5.4.6.3 VS and AUX Open Wire Check
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 SHUTDOWN Mode
          1. 8.4.1.1.1 Exit SHUTDOWN Mode
          2. 8.4.1.1.2 Enter SHUTDOWN Mode
        2. 8.4.1.2 SLEEP Mode
          1. 8.4.1.2.1 Exit SLEEP Mode
          2. 8.4.1.2.2 Enter SLEEP Mode
        3. 8.4.1.3 ACTIVE Mode
          1. 8.4.1.3.1 Exit ACTIVE Mode
          2. 8.4.1.3.2 Enter ACTIVE Mode From SHUTDOWN Mode
          3. 8.4.1.3.3 Enter ACTIVE Mode From SLEEP Mode
      2. 8.4.2 Device Reset
      3. 8.4.3 Ping and Tone
        1. 8.4.3.1 Ping
        2. 8.4.3.2 Tone
        3. 8.4.3.3 Ping and Tone Propagation
    5. 8.5 Register Maps
      1. 8.5.1 OTP Shadow Register Summary
      2. 8.5.2 Read/Write Register Summary
      3. 8.5.3 Read-Only Register Summary
      4. 8.5.4 Register Field Descriptions
        1. 8.5.4.1  Device Addressing Setup
          1. 8.5.4.1.1 DIR0_ADDR_OTP
          2. 8.5.4.1.2 DIR1_ADDR_OTP
          3. 8.5.4.1.3 CUST_MISC1 through CUST_MISC8
          4. 8.5.4.1.4 DIR0_ADDR
          5. 8.5.4.1.5 DIR1_ADDR
        2. 8.5.4.2  Device ID and Scratch Pad
          1. 8.5.4.2.1 PARTID
          2. 8.5.4.2.2 DEV_REVID
          3. 8.5.4.2.3 DIE_ID1 through DIE_ID9
        3. 8.5.4.3  General Configuration and Control
          1. 8.5.4.3.1  DEV_CONF
          2. 8.5.4.3.2  PWR_TRANSIT_CONF
          3. 8.5.4.3.3  COMM_TIMEOUT_CONF
          4. 8.5.4.3.4  TX_HOLD_OFF
          5. 8.5.4.3.5  STACK_RESPONSE
          6. 8.5.4.3.6  COMM_CTRL
          7. 8.5.4.3.7  CONTROL1
          8. 8.5.4.3.8  CONTROL2
          9. 8.5.4.3.9  CUST_CRC_HI
          10. 8.5.4.3.10 CUST_CRC_LO
          11. 8.5.4.3.11 CUST_CRC_RSLT_HI
          12. 8.5.4.3.12 CUST_CRC_RSLT_LO
        4. 8.5.4.4  Operation Status
          1. 8.5.4.4.1 DIAG_STAT
          2. 8.5.4.4.2 ADC_STAT1
          3. 8.5.4.4.3 ADC_STAT2
          4. 8.5.4.4.4 GPIO_STAT
          5. 8.5.4.4.5 DEV_STAT
        5. 8.5.4.5  ADC Configuration and Control
          1. 8.5.4.5.1  ADC_CONF1
          2. 8.5.4.5.2  ADC_CONF2
          3. 8.5.4.5.3  MAIN_ADC_CAL1
          4. 8.5.4.5.4  MAIN_ADC_CAL2
          5. 8.5.4.5.5  AUX_ADC_CAL1
          6. 8.5.4.5.6  AUX_ADC_CAL2
          7. 8.5.4.5.7  CS_ADC_CAL1
          8. 8.5.4.5.8  CS_ADC_CAL2
          9. 8.5.4.5.9  ADC_CTRL1
          10. 8.5.4.5.10 ADC_CTRL2
          11. 8.5.4.5.11 ADC_CTRL3
        6. 8.5.4.6  ADC Measurement Results
          1. 8.5.4.6.1  VS16_HI/LO
          2. 8.5.4.6.2  VS15_HI/LO
          3. 8.5.4.6.3  VS14_HI/LO
          4. 8.5.4.6.4  VS13_HI/LO
          5. 8.5.4.6.5  VS12_HI/LO
          6. 8.5.4.6.6  VS11_HI/LO
          7. 8.5.4.6.7  VS10_HI/LO
          8. 8.5.4.6.8  VS9_HI/LO
          9. 8.5.4.6.9  VS8_HI/LO
          10. 8.5.4.6.10 VS7_HI/LO
          11. 8.5.4.6.11 VS6_HI/LO
          12. 8.5.4.6.12 VS5_HI/LO
          13. 8.5.4.6.13 VS4_HI/LO
          14. 8.5.4.6.14 VS3_HI/LO
          15. 8.5.4.6.15 VS2_HI/LO
          16. 8.5.4.6.16 VS1_HI/LO
          17. 8.5.4.6.17 CSAUX_HI/LO
          18. 8.5.4.6.18 TSREF_HI/LO
          19. 8.5.4.6.19 GPIO1_HI/LO
          20. 8.5.4.6.20 GPIO2_HI/LO
          21. 8.5.4.6.21 GPIO3_HI/LO
          22. 8.5.4.6.22 GPIO4_HI/LO
          23. 8.5.4.6.23 GPIO5_HI/LO
          24. 8.5.4.6.24 GPIO6_HI/LO
          25. 8.5.4.6.25 GPIO7_HI/LO
          26. 8.5.4.6.26 GPIO8_HI/LO
          27. 8.5.4.6.27 DIETEMP1_HI/LO
          28. 8.5.4.6.28 DIETEMP2_HI/LO
          29. 8.5.4.6.29 AUX_IN_HI/LO
          30. 8.5.4.6.30 AUX_GPIO_HI/LO
          31. 8.5.4.6.31 AUX_PWR_HI/LO
          32. 8.5.4.6.32 AUX_REFL_HI/LO
          33. 8.5.4.6.33 AUX_VBG2_HI/LO
          34. 8.5.4.6.34 AUX_AVAO_REF_HI/LO
          35. 8.5.4.6.35 AUX_AVDD_REF_HI/LO
          36. 8.5.4.6.36 AUX_OV_DAC_HI/LO
          37. 8.5.4.6.37 AUX_UV_DAC_HI/LO
          38. 8.5.4.6.38 AUX_VCM1_HI/LO
          39. 8.5.4.6.39 REFH_HI/LO
          40. 8.5.4.6.40 DIAG_MAIN_HI/LO
          41. 8.5.4.6.41 DIAG_AUX_HI/LO
          42. 8.5.4.6.42 CURRENT_HI/MID/LO
        7. 8.5.4.7  Protector Configuration and Control
          1. 8.5.4.7.1 OV_THRESH
          2. 8.5.4.7.2 UV_THRESH
          3. 8.5.4.7.3 UV_DISABLE1
          4. 8.5.4.7.4 UV_DISABLE2
          5. 8.5.4.7.5 OVUV_CTRL
        8. 8.5.4.8  GPIO Configuration
          1. 8.5.4.8.1 GPIO_CONF1
          2. 8.5.4.8.2 GPIO_CONF2
          3. 8.5.4.8.3 GPIO_CONF3
          4. 8.5.4.8.4 GPIO_CONF4
        9. 8.5.4.9  SPI Master
          1. 8.5.4.9.1 SPI_CONF
          2. 8.5.4.9.2 SPI_EXE
          3. 8.5.4.9.3 SPI_TX3, SPI_TX2, and SPI_TX1
          4. 8.5.4.9.4 SPI_RX3, SPI_RX2, and SPI_RX1
        10. 8.5.4.10 Diagnostic Control
          1. 8.5.4.10.1 DIAG_OTP_CTRL
          2. 8.5.4.10.2 DIAG_COMM_CTRL
          3. 8.5.4.10.3 DIAG_PWR_CTRL
          4. 8.5.4.10.4 DIAG_COMP_CTRL1
          5. 8.5.4.10.5 DIAG_COMP_CTRL2
          6. 8.5.4.10.6 DIAG_COMP_CTRL3
          7. 8.5.4.10.7 DIAG_COMP_CTRL4
          8. 8.5.4.10.8 DIAG_PROT_CTRL
        11. 8.5.4.11 Fault Configuration and Reset
          1. 8.5.4.11.1 FAULT_MSK1
          2. 8.5.4.11.2 FAULT_MSK2
          3. 8.5.4.11.3 FAULT_RST1
          4. 8.5.4.11.4 FAULT_RST2
        12. 8.5.4.12 Fault Status
          1. 8.5.4.12.1  FAULT_SUMMARY
          2. 8.5.4.12.2  FAULT_COMM1
          3. 8.5.4.12.3  FAULT_COMM2
          4. 8.5.4.12.4  FAULT_COMM3
          5. 8.5.4.12.5  FAULT_OTP
          6. 8.5.4.12.6  FAULT_SYS
          7. 8.5.4.12.7  FAULT_PROT1
          8. 8.5.4.12.8  FAULT_PROT2
          9. 8.5.4.12.9  FAULT_OV1
          10. 8.5.4.12.10 FAULT_OV2
          11. 8.5.4.12.11 FAULT_UV1
          12. 8.5.4.12.12 FAULT_UV2
          13. 8.5.4.12.13 FAULT_COMP_GPIO
          14. 8.5.4.12.14 FAULT_COMP_VSAUX1
          15. 8.5.4.12.15 FAULT_COMP_VSAUX2
          16. 8.5.4.12.16 FAULT_COMP_VSOW1
          17. 8.5.4.12.17 FAULT_COMP_VSOW2
          18. 8.5.4.12.18 FAULT_COMP_AUXOW1
          19. 8.5.4.12.19 FAULT_COMP_AUXOW2
          20. 8.5.4.12.20 FAULT_COMP_MISC
          21. 8.5.4.12.21 FAULT_PWR1
          22. 8.5.4.12.22 FAULT_PWR2
          23. 8.5.4.12.23 FAULT_PWR3
        13. 8.5.4.13 Debug Control and Status
          1. 8.5.4.13.1  DEBUG_CTRL_UNLOCK
          2. 8.5.4.13.2  DEBUG_COMM_CTRL1
          3. 8.5.4.13.3  DEBUG_COMM_CTRL2
          4. 8.5.4.13.4  DEBUG_COMM_STAT
          5. 8.5.4.13.5  DEBUG_UART_RC
          6. 8.5.4.13.6  DEBUG_UART_RR_TR
          7. 8.5.4.13.7  DEBUG_COMH_BIT
          8. 8.5.4.13.8  DEBUG_COMH_RC
          9. 8.5.4.13.9  DEBUG_COMH_RR_TR
          10. 8.5.4.13.10 DEBUG_COML_BIT
          11. 8.5.4.13.11 DEBUG_COML_RC
          12. 8.5.4.13.12 DEBUG_COML_RR_TR
          13. 8.5.4.13.13 DEBUG_UART_DISCARD
          14. 8.5.4.13.14 DEBUG_COMH_DISCARD
          15. 8.5.4.13.15 DEBUG_COML_DISCARD
          16. 8.5.4.13.16 DEBUG_UART_VALID_HI/LO
          17. 8.5.4.13.17 DEBUG_COMH_VALID_HI/LO
          18. 8.5.4.13.18 DEBUG_COML_VALID_HI/LO
          19. 8.5.4.13.19 DEBUG_OTP_SEC_BLK
          20. 8.5.4.13.20 DEBUG_OTP_DED_BLK
        14. 8.5.4.14 OTP Programming Control and Status
          1. 8.5.4.14.1 OTP_PROG_UNLOCK1A through OTP_PROG_UNLOCK1D
          2. 8.5.4.14.2 OTP_PROG_UNLOCK2A through OTP_PROG_UNLOCK2D
          3. 8.5.4.14.3 OTP_PROG_CTRL
          4. 8.5.4.14.4 OTP_ECC_TEST
          5. 8.5.4.14.5 OTP_ECC_DATAIN1 through OTP_ECC_DATAIN9
          6. 8.5.4.14.6 OTP_ECC_DATAOUT1 through OTP_ECC_DATAOUT9
          7. 8.5.4.14.7 OTP_PROG_STAT
          8. 8.5.4.14.8 OTP_CUST1_STAT
          9. 8.5.4.14.9 OTP_CUST2_STAT
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Base Device Application Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  PACK+ and FUSE Measurement
          2. 9.2.1.2.2  Insulation Measurement
          3. 9.2.1.2.3  LINK+/- Measurement
          4. 9.2.1.2.4  CHARGE+/– Measurement
          5. 9.2.1.2.5  Overcurrent Detection Scheme Using OVUV Comparators
          6. 9.2.1.2.6  Unused Pins
          7. 9.2.1.2.7  Current Sense Input
          8. 9.2.1.2.8  VPWR and External NPN
          9. 9.2.1.2.9  Power Supplies, Reference Input
          10. 9.2.1.2.10 GPIO For Thermistor Inputs
          11. 9.2.1.2.11 UART, NFAULT
          12. 9.2.1.2.12 Daisy-Chain Isolation
            1. 9.2.1.2.12.1 Devices Connected on the Same PCB
            2. 9.2.1.2.12.2 Devices Connected on Different PCBs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Daisy Device Application Circuit
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground Planes
      2. 11.1.2 Bypass Capacitors for Power Supplies and Reference
      3. 11.1.3 Voltage Sensing
      4. 11.1.4 Daisy-Chain Communication
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6 Timing Requirements

over operating -40℃ to 125℃ free-air temperature range, VVPWR = 9V to 15V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
POWER STATE TIMING
tSU(WAKE_SHUT) Startup from SHUTDOWN to ACTIVE mode Base device: From the end of WAKE ping to the start of a forwading WAKE tone 6 10 ms
Stack device: From the end of a recevied WAKE tone to the start of a forwading WAKE tone 6 10 ms
tSU(SLP2ACT) Startup from SLEEP to ACTIVE mode (with SLEEP2ACTIVE ping/tone) Base device: From the end of  SLEEP2ACTIVE ping to the start of the forwarding SLEEP2ACTIVE tone 230 µs
Stack device: From the end of  SLEEP2ACTIVE tone to the start of the forwarding SLEEP2ACTIVE tone 230 µs
tSU(WAKE_SLP) Startup from SLEEP to ACTIVE mode (with WAKE ping/tone) Base device: From the end of WAKE ping to the start of a forwading WAKE tone 1 ms
Stack device: From the end of a recevied WAKE tone to the start of a forwading WAKE tone 1 ms
tSLP From ACTIVE to SLEEP mode From receiving SLEEP entry condition to enter in SLEEP mode 100 µs
tSHTDN From ACTIVE to SLHUTDOWN mode From receiving SHUTDOWN entry condition to enter in SHUTDOWN mode (all LDOs in 10% of their norminal value) 20 ms
tRST Reset time during ACTIVE mode CONTROL1[SOFT_RST] = 1 is sent to a completion of the digital reset 1 ms
tHWRST The time device will be in HW reset, after HW reset ping/tone issued  75 ms
SUPPLIES TIMING
tTSREF_ON TSREF ramp up time (10%-90%) CTSREF = 1µF 6 ms
tTSREF_OFF TSREF ramp down time (90%-10%) CTSREF = 1µF 8 ms
PING SIGNAL TIMING
tHLD_WAKE WAKE ping low time on RX pin; no external load on CVDD 2 2.5 ms
tHLD_SD SHUTDOWN ping low time on RX pin; no external load on CVDD 7 10 ms
tUART(StA) SLEEPtoACTIVE ping low time on RX pin 250 300 µs
tHLD_HWRST HW_RESET ping low time on RX pin 36 ms
COML and COMH (PULSE and TONE TIMING)
tPW_DC COMM: Pulse width of data (half bit time) for communiction  250 ns
tRECLK_DC COMM: data reclocking delay per device from COMH to COML or viceversa   4 5 µs
tCOMTONE Time between pulses of comm tones (HFO based). Comm Tones are WAKE, SLEEPtoACTIVE, SHUTDOWN, HWRST tones 11 15 µs
tCOMMTONE_HI The HIGH time of each comms pulse (HFO base) 0.92 1 1.08 µs
tCOMMTONE_LO The LOW time of each comms pulse (HFO base) 0.92 1 1.08 µs
tFLTTONE Time between pulses of FAULT Tone (LFO based). Applies to FAULT Tone and HEARTBEAT 11.5 µs
tFLTTONE_HI The HIGH time of each pulse of the tone couplete 1 µs
tFLTTONE_LO The LOW time of each pulse of the tone couplete 1 µs
nWAKEDET Number of pulses to detect as a WAKE tone 60 pulses
nWAKE Number of pulses to transit for a WAKE tone 90 pulses
nSHDNDET Number of pulses to detect as a SHUTDOWN tone 180 pulses
nSHDN Number of pulses to transit for a SHUTDOWN tone 270 pulses
nSLPtoACTDET Number of pulses to detect as a SLEEPtoACTIVE tone 20 pulses
nSLPtoACT Number of pulses to transit for a SLEEPtoACTIVE tone 30 pulses
nHWRSTDET Number of pulses to detect as a HW_RESET tone 540 pulses
nHWRST Number of pulses to transit for a HW_RESET tone 810 pulses
nHBDET HEARTBEAT: Number of pulses  to detect as a valid tone   20   pulses
nHB HEARTBEAT: Number of pulses to transit for a tone   30   pulses
tHB_PERIOD HEARTBEAT: Period between HEARTBEAT  Burst (from the beginning of a HEARTBEAT to the beginning of the next HEARTBEAT) 360 400 440 ms
tHB_TIMEOUT HEARTBEAT: Timeout to considered as not receving HEARTBEAT  0.9 1 1.1 s
tHB_FAST HEARTBEAT: If HEARTBEAT is received within this time, it is considered receving HEARTBEAT too fast    200   ms
nFTONEDET FAULT TONE: Number of pulses  to detect as a valid tone   60   pulses
nFTONE FAULT TONE: Number of pulses to transit for a tone   90   pulses
tFTONE_PERIOD FAULT TONE: Period between FAULT TONE Burst (from the beginning of a FAULT TONE to the beginning of the next
FAULT TONE)		   50   ms
tFTS_LATENCY Fault Tone latency in Stack Device From time a device receive the tone to the time the same device detects and generate its fault tone 48 µs
tFTB_LATENCY Fault Tone latency in Base Device From the time a device receive the tone to the time the same device detects and asserts NFAULT 24 µs
MAIN and AUX ADC TIMING
tSAR_CONV Single conversion time (both Main and AUX ADCs)    8   µs
tMAIN_ADC_CYCLE Single round robin cycle (Main ADC)   192   µs
tAUX_ADC_CYCLE Single round robin cycle (AUX ADC)   192   µs
tAFE_SETTLE Analog front end (Level shifters) settling time whenever device enter ACTIVE mode from SLEEP or SHUTDOWN   4   ms
tCS_SETTLE CS ADC settling time 62 µs
tCS_REFRESH Continious mode refresh rate CS_DS[1:0] = 11   4.096   ms
tCS_REFRESH Continious mode refresh rate CS_DS[1:0] = 10 1.024   ms
tCS_REFRESH Continious mode refresh rate CS_DS[1:0] = 01 0.512 ms
tCS_REFRESH Continious mode refresh rate CS_DS[1:0] = 00 0.256 ms
tCS_CONV Single conversion time on CS ADC CS_DS[1:0] = 11   12.350   ms
CS_DS[1:0] = 10   3.134   ms
CS_DS[1:0] = 01   1.598   ms
CS_DS[1:0] = 00   0.83   ms
tADC_ACC This includes mux round robin, ADC conversions, and digital filters. -1.5 1.5 %
HW COMPARATORS/PROTECTORS TIMING
tOV_CYCLE OV round robin cycle   8   ms
tUV_CYCLE UV round robin cycle   8   ms
tOVUV_BIST_CYCLE OV and UV BIST cycle 21.8 23 24.2 ms
tPWR_BIST_CYCLE Time needed for the power supply BIST to complete after the power BIST go command 10.9 11.5 12.1 ms
tHW_COMP_ACC OV,UV comparators timing accuracy -5 5 %
I/O TIMING (TX, RX, GPIO, NFAULT)
tRISE Rise Time VCVDD  > MIN VCVDD, CLOAD = 150pF, GPIO in output mode  12 ns
tFALL Fall Time (exclude NFAULT) VCVDD  > MIN VCVDD, CLOAD = 150pF, GPIO in output mode  7 ns
tFALL_NFAULT Fall Time on NFAULT VCVDD  > MIN VCVDD, CLOAD = 150pF, RPULLUP = 10kΩ   100 ns
UART TIMING
UARTBAUD UART TX/RX Baud Rate 1 Mbps
UARTERR_BAUD(RX) UART RX baud rate error - requirement on the external host -1   1 %
UARTERR_BAUD(TX) UART TX baud rate error -1.5   1.5 %
tUART(CLR) UART Clear low time 15   20 bit period
tUART(RX_HIGH) After COMM CLEAR, wait this time before sending new frame 1     bit period
OTP NVM TIMING
tCRC_CUST Time to complet a single cycle of CRC check on the customer OTP space 175 µs
tCRC_FACT Time to complet a single cycle of CRC check on the factory OTP space 1.6 ms
SPI MASTER TIMING
fSCLK SCLK frequency   450 500 550 kHz
tHIGH, tLOW  SCLK duty cycle   50 %
tSS(HIGH) SS HIGH latency time. Time from register write high to SS pin high     4   µs
tSS(LOW) SS LOW latency time. Time from register write low to SS pin low     4   µs
tSU(MISO) MISO input data setup time - requirement for slave device MISO stable before SCLK transition 100     ns
tHD(MISO) MISO input dat hold time MISO stable after SCLK transition   0   ns
OSCILLATOR
fHFO High frequency oscillator 31.52 32 32.48 MHz
fLFO Low frequency oscillator 248.9 262 275.1 kHz