ZHCSM89 july   2021 BQ51013B-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Details of a Qi Wireless Power System and BQ51013B-Q1 Power Transfer Flow Diagrams
      2. 9.3.2  Dynamic Rectifier Control
      3. 9.3.3  Dynamic Efficiency Scaling
      4. 9.3.4  RILIM Calculations
      5. 9.3.5  Input Overvoltage
      6. 9.3.6  Adapter Enable Functionality and EN1/EN2 Control
      7. 9.3.7  End Power Transfer Packet (WPC Header 0x02)
      8. 9.3.8  Status Outputs
      9. 9.3.9  WPC Communication Scheme
      10. 9.3.10 Communication Modulator
      11. 9.3.11 Adaptive Communication Limit
      12. 9.3.12 Synchronous Rectification
      13. 9.3.13 Temperature Sense Resistor Network (TS)
      14. 9.3.14 3-State Driver Recommendations for the TS/CTRL Pin
      15. 9.3.15 Thermal Protection
      16. 9.3.16 WPC v1.2 Compliance – Foreign Object Detection
      17. 9.3.17 Receiver Coil Load-Line Analysis
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 BQ51013B-Q1 Wireless Power Receiver Used as a Power Supply
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Using The BQ51013B-Q1 as a Wireless Power Supply: (See )
          2. 10.2.1.2.2 Series and Parallel Resonant Capacitor Selection
          3. 10.2.1.2.3 Recommended RX Coils
          4. 10.2.1.2.4 COMM, CLAMP, and BOOT Capacitors
          5. 10.2.1.2.5 Control Pins and CHG
          6. 10.2.1.2.6 Current Limit and FOD
          7. 10.2.1.2.7 RECT and OUT Capacitance
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Dual Power Path: Wireless Power and DC Input
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Wireless and Direct Charging of a Li-Ion Battery at 800 mA
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方产品免责声明
      2. 13.1.2 Development Support
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13.5 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。