SLUSG28 August   2025 BQ25176K

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Power Up from Input Source
        1. 6.3.1.1 ISET Pin Detection
        2. 6.3.1.2 VSET Pin Detection
        3. 6.3.1.3 Charger Power Up
      2. 6.3.2 Battery Charging Features
        1. 6.3.2.1 Lithium-Ion Battery Charging Profile
        2. 6.3.2.2 Input Voltage Based Dynamic Power Management (VINDPM)
        3. 6.3.2.3 Charge Termination and Battery Recharge
        4. 6.3.2.4 Charging Safety Timers
        5. 6.3.2.5 Battery Temperature Qualification (TS Pin)
      3. 6.3.3 Status Outputs ( PG, STAT)
        1. 6.3.3.1 Power Good Indicator (PG Pin)
        2. 6.3.3.2 Charging Status Indicator (STAT)
      4. 6.3.4 Protection Features
        1. 6.3.4.1 Input Overvoltage Protection (VIN_OV)
        2. 6.3.4.2 Output Overvoltage Protection (VOUT_OVP)
        3. 6.3.4.3 Output Overcurrent Protection (IOUT_OCP)
        4. 6.3.4.4 Thermal Regulation and Thermal Shutdown (TREG and TSHUT)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown or Undervoltage Lockout (UVLO)
      2. 6.4.2 Sleep Mode
      3. 6.4.3 Active Mode
        1. 6.4.3.1 Standby Mode
      4. 6.4.4 Fault Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Li-Ion Charger Design Example
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DSG|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) BQ25176K UNIT
DSG
8 PINS
RθJA Junction-to-ambient thermal resistance (JEDEC(1)) 75.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93.4 °C/W
RθJB Junction-to-board thermal resistance 41.8 °C/W
ΨJT Junction-to-top characterization parameter 3.8 °C/W
ΨJB Junction-to-board characterization parameter 41.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 17.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.