ZHCSJ79C December   2018  – January 2022 AWR1843

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Signal Descriptions - Digital
      2. 7.2.2 Signal Descriptions - Analog
    3. 7.3 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Supply Specifications
    6. 8.6  Power Consumption Summary
    7. 8.7  RF Specification
    8. 8.8  CPU Specifications
    9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1  Power Supply Sequencing and Reset Timing
      2. 8.10.2  Input Clocks and Oscillators
        1. 8.10.2.1 Clock Specifications
      3. 8.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.10.3.1 Peripheral Description
        2. 8.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. 8.10.3.2.1 SPI Timing Conditions
          2. 8.10.3.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
          3. 8.10.3.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
        3. 8.10.3.3 SPI Peripheral Mode I/O Timings
          1. 8.10.3.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 8.10.3.4 Typical Interface Protocol Diagram (Peripheral Mode)
      4. 8.10.4  LVDS Interface Configuration
        1. 8.10.4.1 LVDS Interface Timings
      5. 8.10.5  General-Purpose Input/Output
        1. 8.10.5.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      6. 8.10.6  Controller Area Network Interface (DCAN)
        1. 8.10.6.1 Dynamic Characteristics for the DCANx TX and RX Pins
      7. 8.10.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 8.10.7.1 Dynamic Characteristics for the CANx TX and RX Pins
      8. 8.10.8  Serial Communication Interface (SCI)
        1. 8.10.8.1 SCI Timing Requirements
      9. 8.10.9  Inter-Integrated Circuit Interface (I2C)
        1. 8.10.9.1 I2C Timing Requirements (1)
      10. 8.10.10 Quad Serial Peripheral Interface (QSPI)
        1. 8.10.10.1 QSPI Timing Conditions
        2. 8.10.10.2 Timing Requirements for QSPI Input (Read) Timings (1) (1)
        3. 8.10.10.3 QSPI Switching Characteristics
      11. 8.10.11 ETM Trace Interface
        1. 8.10.11.1 ETMTRACE Timing Conditions
        2. 8.10.11.2 ETM TRACE Switching Characteristics
      12. 8.10.12 Data Modification Module (DMM)
        1. 8.10.12.1 DMM Timing Requirements
      13. 8.10.13 JTAG Interface
        1. 8.10.13.1 JTAG Timing Conditions
        2. 8.10.13.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.10.13.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Automotive Interface
      4. 9.3.4 Main Subsystem Cortex-R4F Memory Map
      5. 9.3.5 DSP Subsystem Memory Map
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
        1. 9.4.1.1 GP-ADC Parameter
  10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
      1. 10.1.1 Error Signaling Module
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Short- and Medium-Range Radar
    3. 11.3 Reference Schematic
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2. 13.2 Tray Information for

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ABL|161
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from May 1, 2020 to December 31, 2021 (from Revision B (May 2020) to Revision C (December 2021))

  • Section 1（特性）：将 RX 噪声系数值从“14dB”更新/更改为“12dB”Go
  • （特性）：将 1MHz 时的相位噪声值从“–92dBc/Hz”更新/更改为“–93dBc/Hz”Go
  • 通篇：已更新以反映功能安全合规性Go
  • 通篇：将“A2D”替换为“ADC”；将“主子系统”和“主 R4F”更改为“主要子系统”和“主要 R4F”；在主/从术语方面改用了更具包容性的措辞Go
  • （特性）：更新了功能安全合规性认证资料；提及了毫米波传感器的额定工作温度范围；更新了关于器件安全的其他信息 Go
  • （器件信息）：添加了毫米波传感器的其他安全量产器件Go
  • 更新/更改了“功能方框图”以改用包容性术语Go
  • (Device Comparison): Removed a row on Functional-Safety compliance and instead added a table-note for this and LVDS Interface; Additional information on Device security addedGo
  • (Signal Descriptions) :Updated/Changed CLKP and CLKM descriptionsGo
  • (Pin Attributes): Updated/Changed table to remove unsupported mux modes and deleted unsupported CAN signal names.Go
  • (Absolute Maximum Ratings): Added entries for externally supplied power on the RF inputs (TX and RX) and a table-note for the signal level applied on TX.Go
  • (Average Power Consumption at Power Terminals): Updated/Changed the typical average power numbersGo
  • (RF Specifications) : Added lead-in paragraph and "Noise Figure, In-band P1dB vs Receiver Gain" image.Go
  • (Clock Specifications): Updated/Changed Table 8-5 to reflect correct device operating temperature range.Go
  • (Table. External Clock Mode Specifications): Revised frequency tolerance specs from +/-50 to +/-100 ppmGo
  • Added a footnote for L3-Shared memory in DSP C674x Memory Map Go
  • (Monitoring and Diagnostic Mechanisms): Updated/Changed table header and description to reflect Functional Safety-Compliance; added a note for reference to safety related collateralGo
  • (Reference Schematics) : Added weblinks to device EVM documentation collateral Go
  • (Device Nomenclature):Updated/changed Device Nomenclature Go