ZHCSCA3
March 2014
AMC7832
PRODUCTION DATA.
1
特性
2
应用范围
3
说明
4
功率放大器偏置图表
5
修订历史记录
6
Terminal Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
Handling Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements - Serial Interface
7.7
Typical Characteristics: DAC
7.8
Typical Characteristics: ADC
7.9
Typical Characteristics: Reference
7.10
Typical Characteristics: Temperature Sensor
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Digital-to-Analog Converters (DACs)
8.3.1.1
DAC Output Range and Clamp Configuration
8.3.1.2
DAC Register Structure
8.3.1.3
DAC Clear Operation
8.3.2
Analog-to-Digital Converter (ADC)
8.3.2.1
Analog Inputs
8.3.2.1.1
Bipolar Analog Inputs
8.3.2.1.2
Unipolar Analog Inputs
8.3.2.2
ADC Sequencing
8.3.2.3
ADC Synchronization
8.3.2.4
Programmable Out-of-Range Alarms
8.3.2.4.1
Unipolar Inputs Out-of-Range Alarms
8.3.2.4.2
Internal Temperature Sensor Out-of-Range Alarms
8.3.2.4.3
ALARMIN Alarm
8.3.2.4.4
Hysteresis
8.3.2.4.5
False-Alarm Protection
8.3.3
Internal Temperature Sensor
8.3.4
Internal Reference
8.3.5
General Purpose I/Os
8.4
Programming
8.5
Register Map
8.5.1
Interface Configuration: Address 0x00 - 0x02
8.5.2
Device Identification: Address 0x03 - 0x0D
8.5.3
Register Update (Buffered Registers): Address 0x0F
8.5.4
General Device Configuration: Address 0x10 - 0x17
8.5.5
DAC Clear And ALARMOUT Source Select: Address 0x1A - 0x1D
8.5.6
DAC Range: Address 0x1E
8.5.7
ADC Data: Address 0x20 - 0x41
8.5.8
DAC Data: Address 0x50 - 0x67
8.5.9
Status Registers: Address 0x70 - 0x72
8.5.10
Temperature And GPIO Data: Address 0x78 - 0x7A
8.5.11
Out-Of-Range ADC Thresholds: Address 0x80 - 0x93
8.5.12
Hysteresis: Address 0xA0 - 0xA5
8.5.13
Power-Down Registers: Address 0xB0 - 0xB3
8.5.14
ADC Trigger: Address 0xC0
9
Applications and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Application Schematic
9.2.2
Design Requirements
9.2.3
Detailed Design Procedure
9.2.3.1
ADC Input Conditioning
9.2.3.2
DAC Output Range Selection
9.2.3.3
Temperature Sensing Applications
9.2.3.4
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
Trademarks
12.2
Electrostatic Discharge Caution
12.3
Glossary
13
机械封装和可订购信息
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
PAP|64
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsca3_oa
5 修订历史记录
日期
修订版本
注释
3 月
*
最初发布。